JPS4867217U - - Google Patents
Info
- Publication number
- JPS4867217U JPS4867217U JP11248171U JP11248171U JPS4867217U JP S4867217 U JPS4867217 U JP S4867217U JP 11248171 U JP11248171 U JP 11248171U JP 11248171 U JP11248171 U JP 11248171U JP S4867217 U JPS4867217 U JP S4867217U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Stopping Of Electric Motors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11248171U JPS4867217U (en) | 1971-11-29 | 1971-11-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11248171U JPS4867217U (en) | 1971-11-29 | 1971-11-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4867217U true JPS4867217U (en) | 1973-08-25 |
Family
ID=28024808
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11248171U Pending JPS4867217U (en) | 1971-11-29 | 1971-11-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS4867217U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52137014U (en) * | 1976-04-14 | 1977-10-18 | ||
| JPS5341611U (en) * | 1976-09-14 | 1978-04-11 | ||
| KR20240009969A (en) | 2021-05-17 | 2024-01-23 | 파나소닉 아이피 매니지먼트 가부시키가이샤 | Resin composition, prepreg using the same, resin-added film, resin-added metal foil, metal-clad laminate, and wiring board |
-
1971
- 1971-11-29 JP JP11248171U patent/JPS4867217U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52137014U (en) * | 1976-04-14 | 1977-10-18 | ||
| JPS5341611U (en) * | 1976-09-14 | 1978-04-11 | ||
| KR20240009969A (en) | 2021-05-17 | 2024-01-23 | 파나소닉 아이피 매니지먼트 가부시키가이샤 | Resin composition, prepreg using the same, resin-added film, resin-added metal foil, metal-clad laminate, and wiring board |