JPS4866778A - - Google Patents

Info

Publication number
JPS4866778A
JPS4866778A JP10220171A JP10220171A JPS4866778A JP S4866778 A JPS4866778 A JP S4866778A JP 10220171 A JP10220171 A JP 10220171A JP 10220171 A JP10220171 A JP 10220171A JP S4866778 A JPS4866778 A JP S4866778A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10220171A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10220171A priority Critical patent/JPS4866778A/ja
Publication of JPS4866778A publication Critical patent/JPS4866778A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP10220171A 1971-12-15 1971-12-15 Pending JPS4866778A (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10220171A JPS4866778A (fr) 1971-12-15 1971-12-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10220171A JPS4866778A (fr) 1971-12-15 1971-12-15

Publications (1)

Publication Number Publication Date
JPS4866778A true JPS4866778A (fr) 1973-09-12

Family

ID=14321033

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10220171A Pending JPS4866778A (fr) 1971-12-15 1971-12-15

Country Status (1)

Country Link
JP (1) JPS4866778A (fr)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51160065U (fr) * 1975-06-13 1976-12-20
JPS5253668U (fr) * 1975-10-14 1977-04-18
JPS53112375U (fr) * 1977-02-15 1978-09-07
JPS53130971U (fr) * 1977-03-25 1978-10-17
JPS5549513U (fr) * 1978-09-28 1980-03-31
JPS57155755A (en) * 1981-03-23 1982-09-25 Hitachi Ltd Heat sink structure for semiconductor device

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51160065U (fr) * 1975-06-13 1976-12-20
JPS5623895Y2 (fr) * 1975-06-13 1981-06-04
JPS5253668U (fr) * 1975-10-14 1977-04-18
JPS5518999Y2 (fr) * 1975-10-14 1980-05-06
JPS53112375U (fr) * 1977-02-15 1978-09-07
JPS53130971U (fr) * 1977-03-25 1978-10-17
JPS5549513U (fr) * 1978-09-28 1980-03-31
JPS57155755A (en) * 1981-03-23 1982-09-25 Hitachi Ltd Heat sink structure for semiconductor device
JPS6310902B2 (fr) * 1981-03-23 1988-03-10 Hitachi Ltd

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