JPS4865457A - - Google Patents
Info
- Publication number
- JPS4865457A JPS4865457A JP47124470A JP12447072A JPS4865457A JP S4865457 A JPS4865457 A JP S4865457A JP 47124470 A JP47124470 A JP 47124470A JP 12447072 A JP12447072 A JP 12447072A JP S4865457 A JPS4865457 A JP S4865457A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/01—Manufacture or treatment
- H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US20733571A | 1971-12-13 | 1971-12-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4865457A true JPS4865457A (https=) | 1973-09-08 |
Family
ID=22770099
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP47124470A Pending JPS4865457A (https=) | 1971-12-13 | 1972-12-13 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPS4865457A (https=) |
| DE (1) | DE2257845A1 (https=) |
| FR (1) | FR2163443B1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4753694A (en) * | 1986-05-02 | 1988-06-28 | International Business Machines Corporation | Process for forming multilayered ceramic substrate having solid metal conductors |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3256588A (en) * | 1962-10-23 | 1966-06-21 | Philco Corp | Method of fabricating thin film r-c circuits on single substrate |
| US3325881A (en) * | 1963-01-08 | 1967-06-20 | Sperry Rand Corp | Electrical circuit board fabrication |
-
1972
- 1972-11-08 FR FR7240428A patent/FR2163443B1/fr not_active Expired
- 1972-11-25 DE DE2257845A patent/DE2257845A1/de active Pending
- 1972-12-13 JP JP47124470A patent/JPS4865457A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| FR2163443A1 (https=) | 1973-07-27 |
| FR2163443B1 (https=) | 1976-06-04 |
| DE2257845A1 (de) | 1973-06-28 |