JPS4862380A - - Google Patents
Info
- Publication number
- JPS4862380A JPS4862380A JP46097793A JP9779371A JPS4862380A JP S4862380 A JPS4862380 A JP S4862380A JP 46097793 A JP46097793 A JP 46097793A JP 9779371 A JP9779371 A JP 9779371A JP S4862380 A JPS4862380 A JP S4862380A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP46097793A JPS4862380A (ja) | 1971-12-06 | 1971-12-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP46097793A JPS4862380A (ja) | 1971-12-06 | 1971-12-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4862380A true JPS4862380A (ja) | 1973-08-31 |
Family
ID=14201674
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP46097793A Pending JPS4862380A (ja) | 1971-12-06 | 1971-12-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS4862380A (ja) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5723965U (ja) * | 1981-06-25 | 1982-02-06 | ||
| JPH06216093A (ja) * | 1993-01-18 | 1994-08-05 | Mitsubishi Materials Shilicon Corp | 半導体基板の研磨方法とこれを用いた半導体基板の製造方法 |
| JPH0950975A (ja) * | 1995-08-07 | 1997-02-18 | Samsung Electron Co Ltd | ウェーハ研磨装置 |
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1971
- 1971-12-06 JP JP46097793A patent/JPS4862380A/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5723965U (ja) * | 1981-06-25 | 1982-02-06 | ||
| JPS6234689Y2 (ja) * | 1981-06-25 | 1987-09-03 | ||
| JPH06216093A (ja) * | 1993-01-18 | 1994-08-05 | Mitsubishi Materials Shilicon Corp | 半導体基板の研磨方法とこれを用いた半導体基板の製造方法 |
| JPH0950975A (ja) * | 1995-08-07 | 1997-02-18 | Samsung Electron Co Ltd | ウェーハ研磨装置 |