JPS4855669A - - Google Patents
Info
- Publication number
- JPS4855669A JPS4855669A JP9017771A JP9017771A JPS4855669A JP S4855669 A JPS4855669 A JP S4855669A JP 9017771 A JP9017771 A JP 9017771A JP 9017771 A JP9017771 A JP 9017771A JP S4855669 A JPS4855669 A JP S4855669A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9017771A JPS518783B2 (en) | 1971-11-10 | 1971-11-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9017771A JPS518783B2 (en) | 1971-11-10 | 1971-11-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4855669A true JPS4855669A (en) | 1973-08-04 |
| JPS518783B2 JPS518783B2 (en) | 1976-03-19 |
Family
ID=13991188
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9017771A Expired JPS518783B2 (en) | 1971-11-10 | 1971-11-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS518783B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5052467U (en) * | 1973-09-10 | 1975-05-20 | ||
| JPS5267275U (en) * | 1975-11-13 | 1977-05-18 | ||
| JPS5483867U (en) * | 1977-11-25 | 1979-06-14 |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59155757A (en) * | 1983-02-25 | 1984-09-04 | Nippon Steel Corp | Sampler for charge in blast furnace |
| DE10117889A1 (en) * | 2001-04-10 | 2002-10-24 | Osram Opto Semiconductors Gmbh | Leadframe used for a light emitting diode component comprises a chip assembly region, a wire connecting region, external electrical connecting strips, and a support part coupled with a thermal connecting part |
| KR100904152B1 (en) * | 2006-06-30 | 2009-06-25 | 서울반도체 주식회사 | Leadframe having a heat sink supporting part, fabricating method of the light emitting diode package using the same and light emitting diode package fabricated by the method |
-
1971
- 1971-11-10 JP JP9017771A patent/JPS518783B2/ja not_active Expired
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5052467U (en) * | 1973-09-10 | 1975-05-20 | ||
| JPS5267275U (en) * | 1975-11-13 | 1977-05-18 | ||
| JPS595977Y2 (en) * | 1975-11-13 | 1984-02-23 | 株式会社東芝 | Integrated circuit tower equipment |
| JPS5483867U (en) * | 1977-11-25 | 1979-06-14 | ||
| JPS5810361Y2 (en) * | 1977-11-25 | 1983-02-25 | ニチデン機械株式会社 | Resin molded electronic parts |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS518783B2 (en) | 1976-03-19 |