JPS4848568U - - Google Patents
Info
- Publication number
- JPS4848568U JPS4848568U JP1971092905U JP9290571U JPS4848568U JP S4848568 U JPS4848568 U JP S4848568U JP 1971092905 U JP1971092905 U JP 1971092905U JP 9290571 U JP9290571 U JP 9290571U JP S4848568 U JPS4848568 U JP S4848568U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1971092905U JPS4848568U (ja) | 1971-10-08 | 1971-10-08 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1971092905U JPS4848568U (ja) | 1971-10-08 | 1971-10-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS4848568U true JPS4848568U (ja) | 1973-06-26 |
Family
ID=28006381
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1971092905U Pending JPS4848568U (ja) | 1971-10-08 | 1971-10-08 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS4848568U (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5138293U (ja) * | 1974-09-13 | 1976-03-22 | ||
JPH1065089A (ja) * | 1996-08-13 | 1998-03-06 | Hitachi Ltd | リードフレームおよびその製造方法ならびにそれを用いた半導体装置 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1184319A (en) * | 1967-12-27 | 1970-03-11 | Rca Corp | Semiconductor Device Assembly |
-
1971
- 1971-10-08 JP JP1971092905U patent/JPS4848568U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1184319A (en) * | 1967-12-27 | 1970-03-11 | Rca Corp | Semiconductor Device Assembly |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5138293U (ja) * | 1974-09-13 | 1976-03-22 | ||
JPH1065089A (ja) * | 1996-08-13 | 1998-03-06 | Hitachi Ltd | リードフレームおよびその製造方法ならびにそれを用いた半導体装置 |