JPS4843674B1 - - Google Patents
Info
- Publication number
- JPS4843674B1 JPS4843674B1 JP1392269A JP1392269A JPS4843674B1 JP S4843674 B1 JPS4843674 B1 JP S4843674B1 JP 1392269 A JP1392269 A JP 1392269A JP 1392269 A JP1392269 A JP 1392269A JP S4843674 B1 JPS4843674 B1 JP S4843674B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Paints Or Removers (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Organic Insulating Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1392269A JPS4843674B1 (enExample) | 1969-02-26 | 1969-02-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1392269A JPS4843674B1 (enExample) | 1969-02-26 | 1969-02-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4843674B1 true JPS4843674B1 (enExample) | 1973-12-20 |
Family
ID=11846659
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1392269A Pending JPS4843674B1 (enExample) | 1969-02-26 | 1969-02-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS4843674B1 (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS518975A (enExample) * | 1974-06-10 | 1976-01-24 | Tektronix Inc | |
| WO2019146797A1 (ja) * | 2018-01-29 | 2019-08-01 | 日立化成株式会社 | 熱硬化性樹脂組成物、層間絶縁用樹脂フィルム、複合フィルム、プリント配線板及び半導体パッケージ |
-
1969
- 1969-02-26 JP JP1392269A patent/JPS4843674B1/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS518975A (enExample) * | 1974-06-10 | 1976-01-24 | Tektronix Inc | |
| WO2019146797A1 (ja) * | 2018-01-29 | 2019-08-01 | 日立化成株式会社 | 熱硬化性樹脂組成物、層間絶縁用樹脂フィルム、複合フィルム、プリント配線板及び半導体パッケージ |
| JPWO2019146797A1 (ja) * | 2018-01-29 | 2021-01-07 | 昭和電工マテリアルズ株式会社 | 熱硬化性樹脂組成物、層間絶縁用樹脂フィルム、複合フィルム、プリント配線板及び半導体パッケージ |
| TWI868058B (zh) * | 2018-01-29 | 2025-01-01 | 日商力森諾科股份有限公司 | 熱硬化性樹脂組成物之用途 |