JPS4843159A - - Google Patents
Info
- Publication number
- JPS4843159A JPS4843159A JP7767671A JP7767671A JPS4843159A JP S4843159 A JPS4843159 A JP S4843159A JP 7767671 A JP7767671 A JP 7767671A JP 7767671 A JP7767671 A JP 7767671A JP S4843159 A JPS4843159 A JP S4843159A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Casings For Electric Apparatus (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7767671A JPS4843159A (sr) | 1971-10-04 | 1971-10-04 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7767671A JPS4843159A (sr) | 1971-10-04 | 1971-10-04 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS4843159A true JPS4843159A (sr) | 1973-06-22 |
Family
ID=13640472
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7767671A Pending JPS4843159A (sr) | 1971-10-04 | 1971-10-04 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS4843159A (sr) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0260324U (sr) * | 1988-10-26 | 1990-05-02 | ||
JPH0260325U (sr) * | 1988-10-25 | 1990-05-02 | ||
US6731001B2 (en) | 2000-08-10 | 2004-05-04 | Denso Corporation | Semiconductor device including bonded wire based to electronic part and method for manufacturing the same |
-
1971
- 1971-10-04 JP JP7767671A patent/JPS4843159A/ja active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0260325U (sr) * | 1988-10-25 | 1990-05-02 | ||
JPH0260324U (sr) * | 1988-10-26 | 1990-05-02 | ||
US6731001B2 (en) | 2000-08-10 | 2004-05-04 | Denso Corporation | Semiconductor device including bonded wire based to electronic part and method for manufacturing the same |