JPS4842399A - - Google Patents

Info

Publication number
JPS4842399A
JPS4842399A JP47096557A JP9655772A JPS4842399A JP S4842399 A JPS4842399 A JP S4842399A JP 47096557 A JP47096557 A JP 47096557A JP 9655772 A JP9655772 A JP 9655772A JP S4842399 A JPS4842399 A JP S4842399A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP47096557A
Other languages
Japanese (ja)
Other versions
JPS5426720B2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19712148690 external-priority patent/DE2148690C3/en
Application filed filed Critical
Publication of JPS4842399A publication Critical patent/JPS4842399A/ja
Publication of JPS5426720B2 publication Critical patent/JPS5426720B2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H01B3/441Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from alkenes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293Organic, e.g. plastic
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
JP9655772A 1971-09-29 1972-09-26 Expired JPS5426720B2 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19712148690 DE2148690C3 (en) 1971-09-29 Low-pressure molding compound for encasing electronic components

Publications (2)

Publication Number Publication Date
JPS4842399A true JPS4842399A (en) 1973-06-20
JPS5426720B2 JPS5426720B2 (en) 1979-09-05

Family

ID=5820967

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9655772A Expired JPS5426720B2 (en) 1971-09-29 1972-09-26

Country Status (5)

Country Link
JP (1) JPS5426720B2 (en)
CH (1) CH552891A (en)
IT (1) IT967911B (en)
NL (1) NL7211450A (en)
ZA (1) ZA726623B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5994442A (en) * 1982-11-22 1984-05-31 Hitachi Ltd Resin-sealed type semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5994442A (en) * 1982-11-22 1984-05-31 Hitachi Ltd Resin-sealed type semiconductor device

Also Published As

Publication number Publication date
DE2148690B2 (en) 1976-04-08
IT967911B (en) 1974-03-11
JPS5426720B2 (en) 1979-09-05
NL7211450A (en) 1973-04-02
CH552891A (en) 1974-08-15
ZA726623B (en) 1973-06-27
DE2148690A1 (en) 1973-04-05

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