JPS4841697B1 - - Google Patents
Info
- Publication number
- JPS4841697B1 JPS4841697B1 JP45045630A JP4563070A JPS4841697B1 JP S4841697 B1 JPS4841697 B1 JP S4841697B1 JP 45045630 A JP45045630 A JP 45045630A JP 4563070 A JP4563070 A JP 4563070A JP S4841697 B1 JPS4841697 B1 JP S4841697B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP45045630A JPS4841697B1 (en) | 1970-05-29 | 1970-05-29 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP45045630A JPS4841697B1 (en) | 1970-05-29 | 1970-05-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS4841697B1 true JPS4841697B1 (en) | 1973-12-07 |
Family
ID=12724677
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP45045630A Pending JPS4841697B1 (en) | 1970-05-29 | 1970-05-29 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS4841697B1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7714080B2 (en) | 2005-03-07 | 2010-05-11 | Shin-Etsu Chemical Co., Ltd. | Primer composition for semiconductor-encapsulating epoxy resin molding compound and semiconductor device |
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1970
- 1970-05-29 JP JP45045630A patent/JPS4841697B1/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7714080B2 (en) | 2005-03-07 | 2010-05-11 | Shin-Etsu Chemical Co., Ltd. | Primer composition for semiconductor-encapsulating epoxy resin molding compound and semiconductor device |