JPS4841160U - - Google Patents

Info

Publication number
JPS4841160U
JPS4841160U JP8399671U JP8399671U JPS4841160U JP S4841160 U JPS4841160 U JP S4841160U JP 8399671 U JP8399671 U JP 8399671U JP 8399671 U JP8399671 U JP 8399671U JP S4841160 U JPS4841160 U JP S4841160U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8399671U
Other languages
Japanese (ja)
Other versions
JPS556133Y2 (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8399671U priority Critical patent/JPS556133Y2/ja
Publication of JPS4841160U publication Critical patent/JPS4841160U/ja
Application granted granted Critical
Publication of JPS556133Y2 publication Critical patent/JPS556133Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05553—Shape in top view being rectangular

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Bipolar Transistors (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Non-Volatile Memory (AREA)
  • Electrodes Of Semiconductors (AREA)
JP8399671U 1971-09-15 1971-09-15 Expired JPS556133Y2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8399671U JPS556133Y2 (enrdf_load_stackoverflow) 1971-09-15 1971-09-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8399671U JPS556133Y2 (enrdf_load_stackoverflow) 1971-09-15 1971-09-15

Publications (2)

Publication Number Publication Date
JPS4841160U true JPS4841160U (enrdf_load_stackoverflow) 1973-05-25
JPS556133Y2 JPS556133Y2 (enrdf_load_stackoverflow) 1980-02-12

Family

ID=27992716

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8399671U Expired JPS556133Y2 (enrdf_load_stackoverflow) 1971-09-15 1971-09-15

Country Status (1)

Country Link
JP (1) JPS556133Y2 (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6288080U (enrdf_load_stackoverflow) * 1985-11-22 1987-06-05
JPS639143A (ja) * 1986-06-30 1988-01-14 Fujitsu Ltd 半導体装置
JP2007235120A (ja) * 2006-02-03 2007-09-13 Denso Corp 半導体装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6288080U (enrdf_load_stackoverflow) * 1985-11-22 1987-06-05
JPS639143A (ja) * 1986-06-30 1988-01-14 Fujitsu Ltd 半導体装置
JP2007235120A (ja) * 2006-02-03 2007-09-13 Denso Corp 半導体装置

Also Published As

Publication number Publication date
JPS556133Y2 (enrdf_load_stackoverflow) 1980-02-12

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