JPS4840376B1 - - Google Patents
Info
- Publication number
- JPS4840376B1 JPS4840376B1 JP146269A JP146269A JPS4840376B1 JP S4840376 B1 JPS4840376 B1 JP S4840376B1 JP 146269 A JP146269 A JP 146269A JP 146269 A JP146269 A JP 146269A JP S4840376 B1 JPS4840376 B1 JP S4840376B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP146269A JPS4840376B1 (en) | 1969-01-09 | 1969-01-09 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP146269A JPS4840376B1 (en) | 1969-01-09 | 1969-01-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS4840376B1 true JPS4840376B1 (en) | 1973-11-30 |
Family
ID=11502112
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP146269A Pending JPS4840376B1 (en) | 1969-01-09 | 1969-01-09 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS4840376B1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0718880A2 (en) | 1994-12-09 | 1996-06-26 | Texas Instruments Inc. | Apparatus and method for estimating chip yield |
JP2002141240A (en) * | 2000-11-06 | 2002-05-17 | Toyo Denso Co Ltd | Method and device for molding resin for electrical component |
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1969
- 1969-01-09 JP JP146269A patent/JPS4840376B1/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0718880A2 (en) | 1994-12-09 | 1996-06-26 | Texas Instruments Inc. | Apparatus and method for estimating chip yield |
JP2002141240A (en) * | 2000-11-06 | 2002-05-17 | Toyo Denso Co Ltd | Method and device for molding resin for electrical component |