JPS4840376B1 - - Google Patents

Info

Publication number
JPS4840376B1
JPS4840376B1 JP146269A JP146269A JPS4840376B1 JP S4840376 B1 JPS4840376 B1 JP S4840376B1 JP 146269 A JP146269 A JP 146269A JP 146269 A JP146269 A JP 146269A JP S4840376 B1 JPS4840376 B1 JP S4840376B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP146269A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP146269A priority Critical patent/JPS4840376B1/ja
Publication of JPS4840376B1 publication Critical patent/JPS4840376B1/ja
Pending legal-status Critical Current

Links

JP146269A 1969-01-09 1969-01-09 Pending JPS4840376B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP146269A JPS4840376B1 (en) 1969-01-09 1969-01-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP146269A JPS4840376B1 (en) 1969-01-09 1969-01-09

Publications (1)

Publication Number Publication Date
JPS4840376B1 true JPS4840376B1 (en) 1973-11-30

Family

ID=11502112

Family Applications (1)

Application Number Title Priority Date Filing Date
JP146269A Pending JPS4840376B1 (en) 1969-01-09 1969-01-09

Country Status (1)

Country Link
JP (1) JPS4840376B1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0718880A2 (en) 1994-12-09 1996-06-26 Texas Instruments Inc. Apparatus and method for estimating chip yield
JP2002141240A (en) * 2000-11-06 2002-05-17 Toyo Denso Co Ltd Method and device for molding resin for electrical component

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0718880A2 (en) 1994-12-09 1996-06-26 Texas Instruments Inc. Apparatus and method for estimating chip yield
JP2002141240A (en) * 2000-11-06 2002-05-17 Toyo Denso Co Ltd Method and device for molding resin for electrical component

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