JPS4840372A - - Google Patents

Info

Publication number
JPS4840372A
JPS4840372A JP7172171A JP7172171A JPS4840372A JP S4840372 A JPS4840372 A JP S4840372A JP 7172171 A JP7172171 A JP 7172171A JP 7172171 A JP7172171 A JP 7172171A JP S4840372 A JPS4840372 A JP S4840372A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7172171A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7172171A priority Critical patent/JPS4840372A/ja
Publication of JPS4840372A publication Critical patent/JPS4840372A/ja
Pending legal-status Critical Current

Links

JP7172171A 1971-09-17 1971-09-17 Pending JPS4840372A (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7172171A JPS4840372A (enrdf_load_stackoverflow) 1971-09-17 1971-09-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7172171A JPS4840372A (enrdf_load_stackoverflow) 1971-09-17 1971-09-17

Publications (1)

Publication Number Publication Date
JPS4840372A true JPS4840372A (enrdf_load_stackoverflow) 1973-06-13

Family

ID=13468654

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7172171A Pending JPS4840372A (enrdf_load_stackoverflow) 1971-09-17 1971-09-17

Country Status (1)

Country Link
JP (1) JPS4840372A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60121776A (ja) * 1983-12-06 1985-06-29 Toshiba Corp シリコン結晶体の接合方法
JPS60121777A (ja) * 1983-12-06 1985-06-29 Toshiba Corp シリコン結晶体の接合方法
US5152857A (en) * 1990-03-29 1992-10-06 Shin-Etsu Handotai Co., Ltd. Method for preparing a substrate for semiconductor devices
US5654583A (en) * 1994-06-24 1997-08-05 Hitachi, Ltd. Semiconductor device having first and second semiconductor structures directly bonded to each other

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60121776A (ja) * 1983-12-06 1985-06-29 Toshiba Corp シリコン結晶体の接合方法
JPS60121777A (ja) * 1983-12-06 1985-06-29 Toshiba Corp シリコン結晶体の接合方法
US5152857A (en) * 1990-03-29 1992-10-06 Shin-Etsu Handotai Co., Ltd. Method for preparing a substrate for semiconductor devices
US5654583A (en) * 1994-06-24 1997-08-05 Hitachi, Ltd. Semiconductor device having first and second semiconductor structures directly bonded to each other

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