JPS4840372A - - Google Patents
Info
- Publication number
- JPS4840372A JPS4840372A JP7172171A JP7172171A JPS4840372A JP S4840372 A JPS4840372 A JP S4840372A JP 7172171 A JP7172171 A JP 7172171A JP 7172171 A JP7172171 A JP 7172171A JP S4840372 A JPS4840372 A JP S4840372A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7172171A JPS4840372A (Sortimente) | 1971-09-17 | 1971-09-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7172171A JPS4840372A (Sortimente) | 1971-09-17 | 1971-09-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4840372A true JPS4840372A (Sortimente) | 1973-06-13 |
Family
ID=13468654
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7172171A Pending JPS4840372A (Sortimente) | 1971-09-17 | 1971-09-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS4840372A (Sortimente) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60121777A (ja) * | 1983-12-06 | 1985-06-29 | Toshiba Corp | シリコン結晶体の接合方法 |
| JPS60121776A (ja) * | 1983-12-06 | 1985-06-29 | Toshiba Corp | シリコン結晶体の接合方法 |
| US5152857A (en) * | 1990-03-29 | 1992-10-06 | Shin-Etsu Handotai Co., Ltd. | Method for preparing a substrate for semiconductor devices |
| US5654583A (en) * | 1994-06-24 | 1997-08-05 | Hitachi, Ltd. | Semiconductor device having first and second semiconductor structures directly bonded to each other |
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1971
- 1971-09-17 JP JP7172171A patent/JPS4840372A/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60121777A (ja) * | 1983-12-06 | 1985-06-29 | Toshiba Corp | シリコン結晶体の接合方法 |
| JPS60121776A (ja) * | 1983-12-06 | 1985-06-29 | Toshiba Corp | シリコン結晶体の接合方法 |
| US5152857A (en) * | 1990-03-29 | 1992-10-06 | Shin-Etsu Handotai Co., Ltd. | Method for preparing a substrate for semiconductor devices |
| US5654583A (en) * | 1994-06-24 | 1997-08-05 | Hitachi, Ltd. | Semiconductor device having first and second semiconductor structures directly bonded to each other |