JPS4839972A - - Google Patents

Info

Publication number
JPS4839972A
JPS4839972A JP9470672A JP9470672A JPS4839972A JP S4839972 A JPS4839972 A JP S4839972A JP 9470672 A JP9470672 A JP 9470672A JP 9470672 A JP9470672 A JP 9470672A JP S4839972 A JPS4839972 A JP S4839972A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9470672A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS4839972A publication Critical patent/JPS4839972A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/041—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0108—Male die used for patterning, punching or transferring

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP9470672A 1971-09-22 1972-09-22 Pending JPS4839972A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US18285971A 1971-09-22 1971-09-22

Publications (1)

Publication Number Publication Date
JPS4839972A true JPS4839972A (en) 1973-06-12

Family

ID=22670358

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9470672A Pending JPS4839972A (en) 1971-09-22 1972-09-22

Country Status (3)

Country Link
JP (1) JPS4839972A (en)
DE (1) DE2246208A1 (en)
FR (1) FR2153383A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2556756C2 (en) * 1975-12-17 1982-04-08 Kabel- und Metallwerke Gutehoffnungshütte AG, 3000 Hannover Base material for flexible printed circuits
FR2455422A1 (en) * 1979-04-23 1980-11-21 Castanet Raymond DEVICE FOR OBTAINING PRINTED CIRCUITS
US4480150A (en) * 1982-07-12 1984-10-30 Motorola Inc. Lead frame and method
DE4135839A1 (en) * 1991-10-31 1993-05-06 Huels Troisdorf Ag, 5210 Troisdorf, De METHOD FOR PRODUCING A MULTILAYER PRINTED CIRCUIT AND MULTI-LAYER PRINTED CIRCUIT
US5286231A (en) * 1992-03-26 1994-02-15 Kop-Flex, Inc. Flexible elastomer coupling element

Also Published As

Publication number Publication date
DE2246208A1 (en) 1973-03-29
FR2153383A1 (en) 1973-05-04

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