JPS4839866U - - Google Patents
Info
- Publication number
- JPS4839866U JPS4839866U JP1971083979U JP8397971U JPS4839866U JP S4839866 U JPS4839866 U JP S4839866U JP 1971083979 U JP1971083979 U JP 1971083979U JP 8397971 U JP8397971 U JP 8397971U JP S4839866 U JPS4839866 U JP S4839866U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1971083979U JPS4839866U (ja) | 1971-09-13 | 1971-09-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1971083979U JPS4839866U (ja) | 1971-09-13 | 1971-09-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4839866U true JPS4839866U (ja) | 1973-05-18 |
Family
ID=27992687
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1971083979U Pending JPS4839866U (ja) | 1971-09-13 | 1971-09-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS4839866U (ja) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49142020U (ja) * | 1973-03-30 | 1974-12-06 | ||
| JPS5191302U (ja) * | 1975-01-20 | 1976-07-21 | ||
| JPS5332638U (ja) * | 1976-08-25 | 1978-03-22 | ||
| JPS53160375U (ja) * | 1977-05-24 | 1978-12-15 | ||
| JPS56136273U (ja) * | 1980-03-17 | 1981-10-15 | ||
| JP2001156378A (ja) * | 1999-11-29 | 2001-06-08 | Sharp Corp | 発光素子、及びそれを搭載した電子機器 |
| US9130130B2 (en) | 1996-07-29 | 2015-09-08 | Nichia Corporation | Light emitting device and display comprising a plurality of light emitting components on mount |
-
1971
- 1971-09-13 JP JP1971083979U patent/JPS4839866U/ja active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49142020U (ja) * | 1973-03-30 | 1974-12-06 | ||
| JPS5522298Y2 (ja) * | 1973-03-30 | 1980-05-28 | ||
| JPS5191302U (ja) * | 1975-01-20 | 1976-07-21 | ||
| JPS5720876Y2 (ja) * | 1975-01-20 | 1982-05-06 | ||
| JPS5332638U (ja) * | 1976-08-25 | 1978-03-22 | ||
| JPS53160375U (ja) * | 1977-05-24 | 1978-12-15 | ||
| JPS56136273U (ja) * | 1980-03-17 | 1981-10-15 | ||
| US9130130B2 (en) | 1996-07-29 | 2015-09-08 | Nichia Corporation | Light emitting device and display comprising a plurality of light emitting components on mount |
| JP2001156378A (ja) * | 1999-11-29 | 2001-06-08 | Sharp Corp | 発光素子、及びそれを搭載した電子機器 |