JPS4839694B1 - - Google Patents
Info
- Publication number
- JPS4839694B1 JPS4839694B1 JP45089655A JP8965570A JPS4839694B1 JP S4839694 B1 JPS4839694 B1 JP S4839694B1 JP 45089655 A JP45089655 A JP 45089655A JP 8965570 A JP8965570 A JP 8965570A JP S4839694 B1 JPS4839694 B1 JP S4839694B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E30/00—Energy generation of nuclear origin
- Y02E30/30—Nuclear fission reactors
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP45089655A JPS4839694B1 (en) | 1970-10-14 | 1970-10-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP45089655A JPS4839694B1 (en) | 1970-10-14 | 1970-10-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4839694B1 true JPS4839694B1 (en) | 1973-11-26 |
Family
ID=13976757
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP45089655A Pending JPS4839694B1 (en) | 1970-10-14 | 1970-10-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS4839694B1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54163241U (en) * | 1978-05-08 | 1979-11-15 | ||
| WO2008016140A1 (en) * | 2006-08-04 | 2008-02-07 | Panasonic Corporation | Bonding material, bonded portion and circuit board |
| JP2019136785A (en) * | 2018-02-06 | 2019-08-22 | 太平電業株式会社 | Lead plate cutting method and device |
-
1970
- 1970-10-14 JP JP45089655A patent/JPS4839694B1/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54163241U (en) * | 1978-05-08 | 1979-11-15 | ||
| WO2008016140A1 (en) * | 2006-08-04 | 2008-02-07 | Panasonic Corporation | Bonding material, bonded portion and circuit board |
| JP2019136785A (en) * | 2018-02-06 | 2019-08-22 | 太平電業株式会社 | Lead plate cutting method and device |