JPS4837778B1 - - Google Patents

Info

Publication number
JPS4837778B1
JPS4837778B1 JP44103718A JP10371869A JPS4837778B1 JP S4837778 B1 JPS4837778 B1 JP S4837778B1 JP 44103718 A JP44103718 A JP 44103718A JP 10371869 A JP10371869 A JP 10371869A JP S4837778 B1 JPS4837778 B1 JP S4837778B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP44103718A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS4837778B1 publication Critical patent/JPS4837778B1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/064—Hermetically-sealed casings sealed by potting, e.g. waterproof resin poured in a rigid casing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Casings For Electric Apparatus (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
JP44103718A 1969-03-12 1969-12-22 Pending JPS4837778B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US80674469A 1969-03-12 1969-03-12

Publications (1)

Publication Number Publication Date
JPS4837778B1 true JPS4837778B1 (ja) 1973-11-13

Family

ID=25194752

Family Applications (1)

Application Number Title Priority Date Filing Date
JP44103718A Pending JPS4837778B1 (ja) 1969-03-12 1969-12-22

Country Status (4)

Country Link
US (1) US3608029A (ja)
JP (1) JPS4837778B1 (ja)
DE (1) DE2011787A1 (ja)
FR (1) FR2033690A5 (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3699200A (en) * 1970-03-19 1972-10-17 Atomic Energy Commission High-resistance electrical conductor encapsulation
FR2423116A1 (fr) * 1978-04-12 1979-11-09 Sev Marchal Appareillage electronique protege et notamment regulateur pour alternateur de vehicules automobiles
US4468363A (en) * 1983-02-02 1984-08-28 Versar Inc. Internal mold gating method and apparatus
DE3442131A1 (de) * 1984-11-17 1986-05-22 Messerschmitt-Bölkow-Blohm GmbH, 8012 Ottobrunn Verfahren zum einkapseln von mikroelektronischen halbleiter- und schichtschaltungen
AT383844B (de) * 1986-01-14 1987-08-25 Frantl Conprojekt Knotenverbindung fuer stabwerke
DE3725269A1 (de) * 1987-07-30 1989-02-09 Messerschmitt Boelkow Blohm Verfahren zum einkapseln von mikroelektronischen halbleiter- und schichtschaltungen
US5230850A (en) * 1991-05-16 1993-07-27 Lewis Raymond O Fan blade reinforcement using bonded hollow spheres
US5381304A (en) * 1993-06-11 1995-01-10 Honeywell Inc. Reworkable encapsulated electronic assembly and method of making same
US6087200A (en) * 1998-08-13 2000-07-11 Clear Logic, Inc. Using microspheres as a stress buffer for integrated circuit prototypes

Also Published As

Publication number Publication date
US3608029A (en) 1971-09-21
DE2011787A1 (de) 1970-09-24
FR2033690A5 (ja) 1970-12-04

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