JPS4837076A - - Google Patents

Info

Publication number
JPS4837076A
JPS4837076A JP46070437A JP7043771A JPS4837076A JP S4837076 A JPS4837076 A JP S4837076A JP 46070437 A JP46070437 A JP 46070437A JP 7043771 A JP7043771 A JP 7043771A JP S4837076 A JPS4837076 A JP S4837076A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP46070437A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP46070437A priority Critical patent/JPS4837076A/ja
Publication of JPS4837076A publication Critical patent/JPS4837076A/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02Bonding areas ; Manufacturing methods related thereto
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/1012Auxiliary members for bump connectors, e.g. spacers
    • H01L2224/10122Auxiliary members for bump connectors, e.g. spacers being formed on the semiconductor or solid-state body to be connected
    • H01L2224/10125Reinforcing structures
    • H01L2224/10126Bump collar

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thyristors (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP46070437A 1971-09-13 1971-09-13 Pending JPS4837076A (xx)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP46070437A JPS4837076A (xx) 1971-09-13 1971-09-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP46070437A JPS4837076A (xx) 1971-09-13 1971-09-13

Publications (1)

Publication Number Publication Date
JPS4837076A true JPS4837076A (xx) 1973-05-31

Family

ID=13431449

Family Applications (1)

Application Number Title Priority Date Filing Date
JP46070437A Pending JPS4837076A (xx) 1971-09-13 1971-09-13

Country Status (1)

Country Link
JP (1) JPS4837076A (xx)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53114998A (en) * 1977-03-18 1978-10-06 Kurimoto Sangiyou Kk Processing of nylon fiber

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53114998A (en) * 1977-03-18 1978-10-06 Kurimoto Sangiyou Kk Processing of nylon fiber

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