JPS4834845B1 - - Google Patents
Info
- Publication number
- JPS4834845B1 JPS4834845B1 JP4275868A JP4275868A JPS4834845B1 JP S4834845 B1 JPS4834845 B1 JP S4834845B1 JP 4275868 A JP4275868 A JP 4275868A JP 4275868 A JP4275868 A JP 4275868A JP S4834845 B1 JPS4834845 B1 JP S4834845B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Transplanting Machines (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4275868A JPS4834845B1 (cs) | 1968-06-20 | 1968-06-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4275868A JPS4834845B1 (cs) | 1968-06-20 | 1968-06-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4834845B1 true JPS4834845B1 (cs) | 1973-10-24 |
Family
ID=12644878
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4275868A Pending JPS4834845B1 (cs) | 1968-06-20 | 1968-06-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS4834845B1 (cs) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS542151U (cs) * | 1977-06-07 | 1979-01-09 | ||
| JPS54164246A (en) * | 1978-03-23 | 1979-12-27 | Stettner & Co | Electrical component material having connection wire to be inserted into holes on circuit board |
| JPS59218793A (ja) * | 1983-05-27 | 1984-12-10 | 富士通株式会社 | Ｄｉｐ形ｉｃの実装方法 |
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1968
- 1968-06-20 JP JP4275868A patent/JPS4834845B1/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS542151U (cs) * | 1977-06-07 | 1979-01-09 | ||
| JPS54164246A (en) * | 1978-03-23 | 1979-12-27 | Stettner & Co | Electrical component material having connection wire to be inserted into holes on circuit board |
| JPS59218793A (ja) * | 1983-05-27 | 1984-12-10 | 富士通株式会社 | Ｄｉｐ形ｉｃの実装方法 |