JPS4834494B1 - - Google Patents

Info

Publication number
JPS4834494B1
JPS4834494B1 JP11942670A JP11942670A JPS4834494B1 JP S4834494 B1 JPS4834494 B1 JP S4834494B1 JP 11942670 A JP11942670 A JP 11942670A JP 11942670 A JP11942670 A JP 11942670A JP S4834494 B1 JPS4834494 B1 JP S4834494B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11942670A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11942670A priority Critical patent/JPS4834494B1/ja
Publication of JPS4834494B1 publication Critical patent/JPS4834494B1/ja
Pending legal-status Critical Current

Links

JP11942670A 1970-12-28 1970-12-28 Pending JPS4834494B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11942670A JPS4834494B1 (en) 1970-12-28 1970-12-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11942670A JPS4834494B1 (en) 1970-12-28 1970-12-28

Publications (1)

Publication Number Publication Date
JPS4834494B1 true JPS4834494B1 (en) 1973-10-22

Family

ID=14761142

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11942670A Pending JPS4834494B1 (en) 1970-12-28 1970-12-28

Country Status (1)

Country Link
JP (1) JPS4834494B1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100408256C (en) * 2006-11-26 2008-08-06 常熟市华银焊料有限公司 Cadmium-free silver solder containing gallium, indium and cerium
CN103909360A (en) * 2014-04-01 2014-07-09 金华市三环焊接材料有限公司 Cadmium-free low-silver solder containing nickel, manganese and indium

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100408256C (en) * 2006-11-26 2008-08-06 常熟市华银焊料有限公司 Cadmium-free silver solder containing gallium, indium and cerium
CN103909360A (en) * 2014-04-01 2014-07-09 金华市三环焊接材料有限公司 Cadmium-free low-silver solder containing nickel, manganese and indium

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