JPS4831462A - - Google Patents

Info

Publication number
JPS4831462A
JPS4831462A JP7069472A JP7069472A JPS4831462A JP S4831462 A JPS4831462 A JP S4831462A JP 7069472 A JP7069472 A JP 7069472A JP 7069472 A JP7069472 A JP 7069472A JP S4831462 A JPS4831462 A JP S4831462A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7069472A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS4831462A publication Critical patent/JPS4831462A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP7069472A 1971-07-14 1972-07-14 Pending JPS4831462A (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB3293271 1971-07-14

Publications (1)

Publication Number Publication Date
JPS4831462A true JPS4831462A (it) 1973-04-25

Family

ID=10346136

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7069472A Pending JPS4831462A (it) 1971-07-14 1972-07-14

Country Status (4)

Country Link
JP (1) JPS4831462A (it)
DE (1) DE2234408A1 (it)
FR (1) FR2145720B1 (it)
IT (1) IT961375B (it)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5332376A (en) * 1976-09-07 1978-03-27 Tokyo Shibaura Electric Co Electric device substrate
JPS5436576A (en) * 1977-08-26 1979-03-17 Shin Kobe Electric Machinery Laminated board for printed wiring circuit with resistance body
WO2004105451A1 (fr) * 2003-05-26 2004-12-02 Lihua Wang Carte de circuit imprime et son procede de production

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2462026A1 (fr) * 1979-07-23 1981-02-06 Lignes Telegraph Telephon Procede de fabrication d'un circuit hybride sur un substrat en acier et circuit en resultant
JPH04355990A (ja) * 1990-09-18 1992-12-09 Fujitsu Ltd 回路基板およびその製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5332376A (en) * 1976-09-07 1978-03-27 Tokyo Shibaura Electric Co Electric device substrate
JPS6149829B2 (it) * 1976-09-07 1986-10-31 Tokyo Shibaura Electric Co
JPS5436576A (en) * 1977-08-26 1979-03-17 Shin Kobe Electric Machinery Laminated board for printed wiring circuit with resistance body
WO2004105451A1 (fr) * 2003-05-26 2004-12-02 Lihua Wang Carte de circuit imprime et son procede de production

Also Published As

Publication number Publication date
DE2234408A1 (de) 1973-01-25
IT961375B (it) 1973-12-10
FR2145720B1 (it) 1976-01-16
FR2145720A1 (it) 1973-02-23

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