JPS4830872A - - Google Patents
Info
- Publication number
- JPS4830872A JPS4830872A JP46064026A JP6402671A JPS4830872A JP S4830872 A JPS4830872 A JP S4830872A JP 46064026 A JP46064026 A JP 46064026A JP 6402671 A JP6402671 A JP 6402671A JP S4830872 A JPS4830872 A JP S4830872A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6402671A JPS559826B2 (enExample) | 1971-08-24 | 1971-08-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6402671A JPS559826B2 (enExample) | 1971-08-24 | 1971-08-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4830872A true JPS4830872A (enExample) | 1973-04-23 |
| JPS559826B2 JPS559826B2 (enExample) | 1980-03-12 |
Family
ID=13246206
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6402671A Expired JPS559826B2 (enExample) | 1971-08-24 | 1971-08-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS559826B2 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6076155A (ja) * | 1983-09-30 | 1985-04-30 | Mitsui Haitetsuku:Kk | リ−ドフレ−ムおよびその製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3426423A (en) * | 1965-07-08 | 1969-02-11 | Molectro Corp | Method of manufacturing semiconductors |
-
1971
- 1971-08-24 JP JP6402671A patent/JPS559826B2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3426423A (en) * | 1965-07-08 | 1969-02-11 | Molectro Corp | Method of manufacturing semiconductors |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6076155A (ja) * | 1983-09-30 | 1985-04-30 | Mitsui Haitetsuku:Kk | リ−ドフレ−ムおよびその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS559826B2 (enExample) | 1980-03-12 |