JPS4830649A - - Google Patents
Info
- Publication number
- JPS4830649A JPS4830649A JP46065032A JP6503271A JPS4830649A JP S4830649 A JPS4830649 A JP S4830649A JP 46065032 A JP46065032 A JP 46065032A JP 6503271 A JP6503271 A JP 6503271A JP S4830649 A JPS4830649 A JP S4830649A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
- H01L2224/78302—Shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01075—Rhenium [Re]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP46065032A JPS4830649A (ko) | 1971-08-25 | 1971-08-25 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP46065032A JPS4830649A (ko) | 1971-08-25 | 1971-08-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS4830649A true JPS4830649A (ko) | 1973-04-23 |
Family
ID=13275216
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP46065032A Pending JPS4830649A (ko) | 1971-08-25 | 1971-08-25 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS4830649A (ko) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5511202U (ko) * | 1978-06-13 | 1980-01-24 | ||
JP2015165566A (ja) * | 2014-02-28 | 2015-09-17 | クリック アンド ソッファ インダストリーズ、インク. | 熱圧着ボンディングシステムおよび当該システムを動作させる方法 |
-
1971
- 1971-08-25 JP JP46065032A patent/JPS4830649A/ja active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5511202U (ko) * | 1978-06-13 | 1980-01-24 | ||
JPS586615Y2 (ja) * | 1978-06-13 | 1983-02-04 | 株式会社東海理化電機製作所 | はんだ付け装置 |
JP2015165566A (ja) * | 2014-02-28 | 2015-09-17 | クリック アンド ソッファ インダストリーズ、インク. | 熱圧着ボンディングシステムおよび当該システムを動作させる方法 |