JPS4829383A - - Google Patents
Info
- Publication number
- JPS4829383A JPS4829383A JP6276771A JP6276771A JPS4829383A JP S4829383 A JPS4829383 A JP S4829383A JP 6276771 A JP6276771 A JP 6276771A JP 6276771 A JP6276771 A JP 6276771A JP S4829383 A JPS4829383 A JP S4829383A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Led Device Packages (AREA)
- Led Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6276771A JPS5227995B2 (en) | 1971-08-18 | 1971-08-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6276771A JPS5227995B2 (en) | 1971-08-18 | 1971-08-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4829383A true JPS4829383A (en) | 1973-04-18 |
| JPS5227995B2 JPS5227995B2 (en) | 1977-07-23 |
Family
ID=13209851
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6276771A Expired JPS5227995B2 (en) | 1971-08-18 | 1971-08-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5227995B2 (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5113589A (en) * | 1974-07-25 | 1976-02-03 | Tokyo Shibaura Electric Co | |
| JPS5314470U (en) * | 1976-07-19 | 1978-02-06 | ||
| JPS53138287A (en) * | 1977-05-10 | 1978-12-02 | Agency Of Ind Science & Technol | Solar battery |
| WO2004082036A1 (en) * | 2003-03-10 | 2004-09-23 | Toyoda Gosei Co., Ltd. | Solid element device and method for manufacture thereof |
| JP2006080317A (en) * | 2004-09-09 | 2006-03-23 | Sumita Optical Glass Inc | Solid-state element device |
| JP2006108621A (en) * | 2004-09-09 | 2006-04-20 | Toyoda Gosei Co Ltd | Solid-state element device |
| JPWO2004082036A1 (en) * | 2003-03-10 | 2006-06-15 | 豊田合成株式会社 | Solid element device and manufacturing method thereof |
| US7470926B2 (en) | 2004-09-09 | 2008-12-30 | Toyoda Gosei Co., Ltd | Solid-state optical device |
| US7497597B2 (en) | 2004-01-19 | 2009-03-03 | Toyoda Gosei Co., Ltd. | Light emitting apparatus |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ES2676027T3 (en) | 2012-01-23 | 2018-07-16 | Ventana Medical Systems, Inc. | Stabilization of polymers of chromogen solutions |
-
1971
- 1971-08-18 JP JP6276771A patent/JPS5227995B2/ja not_active Expired
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5113589A (en) * | 1974-07-25 | 1976-02-03 | Tokyo Shibaura Electric Co | |
| JPS5314470U (en) * | 1976-07-19 | 1978-02-06 | ||
| JPS53138287A (en) * | 1977-05-10 | 1978-12-02 | Agency Of Ind Science & Technol | Solar battery |
| JPS5631755B2 (en) * | 1977-05-10 | 1981-07-23 | ||
| WO2004082036A1 (en) * | 2003-03-10 | 2004-09-23 | Toyoda Gosei Co., Ltd. | Solid element device and method for manufacture thereof |
| US8685766B2 (en) | 2003-03-10 | 2014-04-01 | Toyoda Gosei Co., Ltd. | Solid element device and method for manufacturing the same |
| US8154047B2 (en) | 2003-03-10 | 2012-04-10 | Toyoda Gosei Co., Ltd. | Solid element device and method for manufacturing the same |
| JPWO2004082036A1 (en) * | 2003-03-10 | 2006-06-15 | 豊田合成株式会社 | Solid element device and manufacturing method thereof |
| US7824937B2 (en) | 2003-03-10 | 2010-11-02 | Toyoda Gosei Co., Ltd. | Solid element device and method for manufacturing the same |
| US7497597B2 (en) | 2004-01-19 | 2009-03-03 | Toyoda Gosei Co., Ltd. | Light emitting apparatus |
| US7667223B2 (en) | 2004-09-09 | 2010-02-23 | Toyoda Gosei Co., Ltd. | Solid-state optical device |
| US7470926B2 (en) | 2004-09-09 | 2008-12-30 | Toyoda Gosei Co., Ltd | Solid-state optical device |
| JP2006108621A (en) * | 2004-09-09 | 2006-04-20 | Toyoda Gosei Co Ltd | Solid-state element device |
| JP2006080317A (en) * | 2004-09-09 | 2006-03-23 | Sumita Optical Glass Inc | Solid-state element device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5227995B2 (en) | 1977-07-23 |