JPS4828828B1 - - Google Patents

Info

Publication number
JPS4828828B1
JPS4828828B1 JP44029250A JP2925069A JPS4828828B1 JP S4828828 B1 JPS4828828 B1 JP S4828828B1 JP 44029250 A JP44029250 A JP 44029250A JP 2925069 A JP2925069 A JP 2925069A JP S4828828 B1 JPS4828828 B1 JP S4828828B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP44029250A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP44029250A priority Critical patent/JPS4828828B1/ja
Publication of JPS4828828B1 publication Critical patent/JPS4828828B1/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/0711Apparatus therefor
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/072Connecting or disconnecting of bump connectors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
JP44029250A 1969-04-16 1969-04-16 Pending JPS4828828B1 (https=)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP44029250A JPS4828828B1 (https=) 1969-04-16 1969-04-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP44029250A JPS4828828B1 (https=) 1969-04-16 1969-04-16

Publications (1)

Publication Number Publication Date
JPS4828828B1 true JPS4828828B1 (https=) 1973-09-05

Family

ID=12271002

Family Applications (1)

Application Number Title Priority Date Filing Date
JP44029250A Pending JPS4828828B1 (https=) 1969-04-16 1969-04-16

Country Status (1)

Country Link
JP (1) JPS4828828B1 (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS48114430U (https=) * 1972-03-31 1973-12-27
JPS51156626U (https=) * 1975-06-07 1976-12-14
JPS6141417A (ja) * 1984-08-03 1986-02-27 センコ−インテリア株式会社 両面植毛敷物

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS48114430U (https=) * 1972-03-31 1973-12-27
JPS51156626U (https=) * 1975-06-07 1976-12-14
JPS6141417A (ja) * 1984-08-03 1986-02-27 センコ−インテリア株式会社 両面植毛敷物

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