JPS4827491B1 - - Google Patents

Info

Publication number
JPS4827491B1
JPS4827491B1 JP5291270A JP5291270A JPS4827491B1 JP S4827491 B1 JPS4827491 B1 JP S4827491B1 JP 5291270 A JP5291270 A JP 5291270A JP 5291270 A JP5291270 A JP 5291270A JP S4827491 B1 JPS4827491 B1 JP S4827491B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5291270A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS4827491B1 publication Critical patent/JPS4827491B1/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67092Apparatus for mechanical treatment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3043Making grooves, e.g. cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Dicing (AREA)
JP5291270A 1969-06-20 1970-06-19 Pending JPS4827491B1 (xx)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19691931245 DE1931245A1 (de) 1969-06-20 1969-06-20 Verfahren zum Zerteilen von mit Halbleitermaterial beschichteten und mit Bauelementen versehenen Mg-Al-Spinellsubstratscheiben

Publications (1)

Publication Number Publication Date
JPS4827491B1 true JPS4827491B1 (xx) 1973-08-23

Family

ID=5737496

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5291270A Pending JPS4827491B1 (xx) 1969-06-20 1970-06-19

Country Status (8)

Country Link
JP (1) JPS4827491B1 (xx)
AT (1) AT317301B (xx)
CH (1) CH507589A (xx)
DE (1) DE1931245A1 (xx)
FR (1) FR2046933B1 (xx)
GB (1) GB1313003A (xx)
NL (1) NL7006367A (xx)
SE (1) SE351522B (xx)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2648274B1 (fr) * 1989-06-07 1994-07-29 Commissariat Energie Atomique Procede et dispositif de marquage et de clivage de plaquettes de materiaux semi-conducteurs monocristallins

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3169837A (en) * 1963-07-31 1965-02-16 Int Rectifier Corp Method of dicing semiconductor wafers
BE668918A (xx) * 1965-08-27 1900-01-01
DE1652512B2 (de) * 1967-05-29 1976-08-26 Siemens AG, 1000 Berlin und 8000 München Verfahren zum herstellen von halbleiterbauelementen

Also Published As

Publication number Publication date
AT317301B (de) 1974-08-26
GB1313003A (en) 1973-04-11
FR2046933A1 (xx) 1971-03-12
DE1931245A1 (de) 1971-07-08
FR2046933B1 (xx) 1974-09-20
CH507589A (de) 1971-05-15
NL7006367A (xx) 1970-12-22
SE351522B (xx) 1972-11-27

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