JPS4825864A - - Google Patents
Info
- Publication number
- JPS4825864A JPS4825864A JP6091171A JP6091171A JPS4825864A JP S4825864 A JPS4825864 A JP S4825864A JP 6091171 A JP6091171 A JP 6091171A JP 6091171 A JP6091171 A JP 6091171A JP S4825864 A JPS4825864 A JP S4825864A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6091171A JPS4825864A (cs) | 1971-08-11 | 1971-08-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6091171A JPS4825864A (cs) | 1971-08-11 | 1971-08-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4825864A true JPS4825864A (cs) | 1973-04-04 |
Family
ID=13156017
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6091171A Pending JPS4825864A (cs) | 1971-08-11 | 1971-08-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS4825864A (cs) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58186994A (ja) * | 1982-04-23 | 1983-11-01 | 三菱電機株式会社 | 印刷配線板の製造方法 |
| US4895592A (en) * | 1987-12-14 | 1990-01-23 | Eastman Kodak Company | High purity sputtering target material and method for preparing high purity sputtering target materials |
-
1971
- 1971-08-11 JP JP6091171A patent/JPS4825864A/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58186994A (ja) * | 1982-04-23 | 1983-11-01 | 三菱電機株式会社 | 印刷配線板の製造方法 |
| US4895592A (en) * | 1987-12-14 | 1990-01-23 | Eastman Kodak Company | High purity sputtering target material and method for preparing high purity sputtering target materials |