JPS4820363U - - Google Patents

Info

Publication number
JPS4820363U
JPS4820363U JP1971062862U JP6286271U JPS4820363U JP S4820363 U JPS4820363 U JP S4820363U JP 1971062862 U JP1971062862 U JP 1971062862U JP 6286271 U JP6286271 U JP 6286271U JP S4820363 U JPS4820363 U JP S4820363U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1971062862U
Other languages
Japanese (ja)
Other versions
JPS5133160Y2 (cg-RX-API-DMAC7.html
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1971062862U priority Critical patent/JPS5133160Y2/ja
Publication of JPS4820363U publication Critical patent/JPS4820363U/ja
Application granted granted Critical
Publication of JPS5133160Y2 publication Critical patent/JPS5133160Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07168—Means for storing or moving the material for the connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP1971062862U 1971-07-19 1971-07-19 Expired JPS5133160Y2 (cg-RX-API-DMAC7.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1971062862U JPS5133160Y2 (cg-RX-API-DMAC7.html) 1971-07-19 1971-07-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1971062862U JPS5133160Y2 (cg-RX-API-DMAC7.html) 1971-07-19 1971-07-19

Publications (2)

Publication Number Publication Date
JPS4820363U true JPS4820363U (cg-RX-API-DMAC7.html) 1973-03-08
JPS5133160Y2 JPS5133160Y2 (cg-RX-API-DMAC7.html) 1976-08-17

Family

ID=27953462

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1971062862U Expired JPS5133160Y2 (cg-RX-API-DMAC7.html) 1971-07-19 1971-07-19

Country Status (1)

Country Link
JP (1) JPS5133160Y2 (cg-RX-API-DMAC7.html)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5043130U (cg-RX-API-DMAC7.html) * 1973-08-25 1975-05-01
JPS50119845U (cg-RX-API-DMAC7.html) * 1974-03-15 1975-09-30
JPS51110559U (cg-RX-API-DMAC7.html) * 1975-03-03 1976-09-07
JPS51115531U (cg-RX-API-DMAC7.html) * 1975-03-15 1976-09-18
JPS5271656U (cg-RX-API-DMAC7.html) * 1975-11-25 1977-05-28
JPS5321258U (cg-RX-API-DMAC7.html) * 1976-07-31 1978-02-22
JPH04105426U (ja) * 1991-02-25 1992-09-10 松下電工株式会社 スイツチ

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5043130U (cg-RX-API-DMAC7.html) * 1973-08-25 1975-05-01
JPS50119845U (cg-RX-API-DMAC7.html) * 1974-03-15 1975-09-30
JPS51110559U (cg-RX-API-DMAC7.html) * 1975-03-03 1976-09-07
JPS51115531U (cg-RX-API-DMAC7.html) * 1975-03-15 1976-09-18
JPS5271656U (cg-RX-API-DMAC7.html) * 1975-11-25 1977-05-28
JPS5321258U (cg-RX-API-DMAC7.html) * 1976-07-31 1978-02-22
JPH04105426U (ja) * 1991-02-25 1992-09-10 松下電工株式会社 スイツチ

Also Published As

Publication number Publication date
JPS5133160Y2 (cg-RX-API-DMAC7.html) 1976-08-17

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