JPS4812599U - - Google Patents
Info
- Publication number
- JPS4812599U JPS4812599U JP5322771U JP5322771U JPS4812599U JP S4812599 U JPS4812599 U JP S4812599U JP 5322771 U JP5322771 U JP 5322771U JP 5322771 U JP5322771 U JP 5322771U JP S4812599 U JPS4812599 U JP S4812599U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5322771U JPS5133952Y2 (en) | 1971-06-22 | 1971-06-22 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5322771U JPS5133952Y2 (en) | 1971-06-22 | 1971-06-22 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS4812599U true JPS4812599U (en) | 1973-02-12 |
JPS5133952Y2 JPS5133952Y2 (en) | 1976-08-23 |
Family
ID=27935525
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5322771U Expired JPS5133952Y2 (en) | 1971-06-22 | 1971-06-22 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5133952Y2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8946589B2 (en) | 2000-09-13 | 2015-02-03 | Hamamatsu Photonics K.K. | Method of cutting a substrate, method of cutting a wafer-like object, and method of manufacturing a semiconductor device |
-
1971
- 1971-06-22 JP JP5322771U patent/JPS5133952Y2/ja not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8946589B2 (en) | 2000-09-13 | 2015-02-03 | Hamamatsu Photonics K.K. | Method of cutting a substrate, method of cutting a wafer-like object, and method of manufacturing a semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
JPS5133952Y2 (en) | 1976-08-23 |