JPS48112276U - - Google Patents

Info

Publication number
JPS48112276U
JPS48112276U JP3629272U JP3629272U JPS48112276U JP S48112276 U JPS48112276 U JP S48112276U JP 3629272 U JP3629272 U JP 3629272U JP 3629272 U JP3629272 U JP 3629272U JP S48112276 U JPS48112276 U JP S48112276U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3629272U
Other languages
Japanese (ja)
Other versions
JPS5315267Y2 (ko
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3629272U priority Critical patent/JPS5315267Y2/ja
Publication of JPS48112276U publication Critical patent/JPS48112276U/ja
Application granted granted Critical
Publication of JPS5315267Y2 publication Critical patent/JPS5315267Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

Landscapes

  • Die Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP3629272U 1972-03-28 1972-03-28 Expired JPS5315267Y2 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3629272U JPS5315267Y2 (ko) 1972-03-28 1972-03-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3629272U JPS5315267Y2 (ko) 1972-03-28 1972-03-28

Publications (2)

Publication Number Publication Date
JPS48112276U true JPS48112276U (ko) 1973-12-22
JPS5315267Y2 JPS5315267Y2 (ko) 1978-04-21

Family

ID=27903683

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3629272U Expired JPS5315267Y2 (ko) 1972-03-28 1972-03-28

Country Status (1)

Country Link
JP (1) JPS5315267Y2 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53139285U (ko) * 1977-04-07 1978-11-04

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53139285U (ko) * 1977-04-07 1978-11-04

Also Published As

Publication number Publication date
JPS5315267Y2 (ko) 1978-04-21

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