JPS48108152U - - Google Patents
Info
- Publication number
- JPS48108152U JPS48108152U JP2923172U JP2923172U JPS48108152U JP S48108152 U JPS48108152 U JP S48108152U JP 2923172 U JP2923172 U JP 2923172U JP 2923172 U JP2923172 U JP 2923172U JP S48108152 U JPS48108152 U JP S48108152U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Waveguide Connection Structure (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2923172U JPS48108152U (forum.php) | 1972-03-13 | 1972-03-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2923172U JPS48108152U (forum.php) | 1972-03-13 | 1972-03-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS48108152U true JPS48108152U (forum.php) | 1973-12-14 |
Family
ID=27890452
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2923172U Pending JPS48108152U (forum.php) | 1972-03-13 | 1972-03-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS48108152U (forum.php) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5946086A (ja) * | 1982-09-09 | 1984-03-15 | イビデン株式会社 | プリント配線基板とその製造方法 |
| JP2009123736A (ja) * | 2007-11-12 | 2009-06-04 | Nec Corp | デバイスの実装構造及びデバイスの実装方法 |
-
1972
- 1972-03-13 JP JP2923172U patent/JPS48108152U/ja active Pending
Non-Patent Citations (1)
| Title |
|---|
| PROCEEDINGS OF THE SYMPOSIUM ON MICROMINIATURIZATION OF ELECTRONIC ASSMBLIES=1958 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5946086A (ja) * | 1982-09-09 | 1984-03-15 | イビデン株式会社 | プリント配線基板とその製造方法 |
| JP2009123736A (ja) * | 2007-11-12 | 2009-06-04 | Nec Corp | デバイスの実装構造及びデバイスの実装方法 |