JPS48104468A - - Google Patents

Info

Publication number
JPS48104468A
JPS48104468A JP3692272A JP3692272A JPS48104468A JP S48104468 A JPS48104468 A JP S48104468A JP 3692272 A JP3692272 A JP 3692272A JP 3692272 A JP3692272 A JP 3692272A JP S48104468 A JPS48104468 A JP S48104468A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3692272A
Other languages
Japanese (ja)
Other versions
JPS5524262B2 (enrdf_load_html_response
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3692272A priority Critical patent/JPS5524262B2/ja
Publication of JPS48104468A publication Critical patent/JPS48104468A/ja
Publication of JPS5524262B2 publication Critical patent/JPS5524262B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP3692272A 1972-04-14 1972-04-14 Expired JPS5524262B2 (enrdf_load_html_response)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3692272A JPS5524262B2 (enrdf_load_html_response) 1972-04-14 1972-04-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3692272A JPS5524262B2 (enrdf_load_html_response) 1972-04-14 1972-04-14

Publications (2)

Publication Number Publication Date
JPS48104468A true JPS48104468A (enrdf_load_html_response) 1973-12-27
JPS5524262B2 JPS5524262B2 (enrdf_load_html_response) 1980-06-27

Family

ID=12483238

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3692272A Expired JPS5524262B2 (enrdf_load_html_response) 1972-04-14 1972-04-14

Country Status (1)

Country Link
JP (1) JPS5524262B2 (enrdf_load_html_response)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51110969A (ja) * 1975-03-25 1976-09-30 Mitsubishi Electric Corp Handotaisochi

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51110969A (ja) * 1975-03-25 1976-09-30 Mitsubishi Electric Corp Handotaisochi

Also Published As

Publication number Publication date
JPS5524262B2 (enrdf_load_html_response) 1980-06-27

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