JPS48104259U - - Google Patents

Info

Publication number
JPS48104259U
JPS48104259U JP2965872U JP2965872U JPS48104259U JP S48104259 U JPS48104259 U JP S48104259U JP 2965872 U JP2965872 U JP 2965872U JP 2965872 U JP2965872 U JP 2965872U JP S48104259 U JPS48104259 U JP S48104259U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2965872U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2965872U priority Critical patent/JPS48104259U/ja
Publication of JPS48104259U publication Critical patent/JPS48104259U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
JP2965872U 1972-03-10 1972-03-10 Pending JPS48104259U (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2965872U JPS48104259U (fr) 1972-03-10 1972-03-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2965872U JPS48104259U (fr) 1972-03-10 1972-03-10

Publications (1)

Publication Number Publication Date
JPS48104259U true JPS48104259U (fr) 1973-12-05

Family

ID=27891255

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2965872U Pending JPS48104259U (fr) 1972-03-10 1972-03-10

Country Status (1)

Country Link
JP (1) JPS48104259U (fr)

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