JPS48104258U - - Google Patents
Info
- Publication number
- JPS48104258U JPS48104258U JP1972028423U JP2842372U JPS48104258U JP S48104258 U JPS48104258 U JP S48104258U JP 1972028423 U JP1972028423 U JP 1972028423U JP 2842372 U JP2842372 U JP 2842372U JP S48104258 U JPS48104258 U JP S48104258U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1972028423U JPS48104258U (enExample) | 1972-03-10 | 1972-03-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1972028423U JPS48104258U (enExample) | 1972-03-10 | 1972-03-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS48104258U true JPS48104258U (enExample) | 1973-12-05 |
Family
ID=27888967
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1972028423U Pending JPS48104258U (enExample) | 1972-03-10 | 1972-03-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS48104258U (enExample) |
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1972
- 1972-03-10 JP JP1972028423U patent/JPS48104258U/ja active Pending