JPS48101085A - - Google Patents
Info
- Publication number
- JPS48101085A JPS48101085A JP47032481A JP3248172A JPS48101085A JP S48101085 A JPS48101085 A JP S48101085A JP 47032481 A JP47032481 A JP 47032481A JP 3248172 A JP3248172 A JP 3248172A JP S48101085 A JPS48101085 A JP S48101085A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
Landscapes
- Wire Bonding (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3248172A JPS5427714B2 (US20080094685A1-20080424-C00004.png) | 1972-03-31 | 1972-03-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3248172A JPS5427714B2 (US20080094685A1-20080424-C00004.png) | 1972-03-31 | 1972-03-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS48101085A true JPS48101085A (US20080094685A1-20080424-C00004.png) | 1973-12-20 |
| JPS5427714B2 JPS5427714B2 (US20080094685A1-20080424-C00004.png) | 1979-09-11 |
Family
ID=12360164
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3248172A Expired JPS5427714B2 (US20080094685A1-20080424-C00004.png) | 1972-03-31 | 1972-03-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5427714B2 (US20080094685A1-20080424-C00004.png) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5717178A (en) * | 1980-07-07 | 1982-01-28 | Nec Corp | Field-effect transistor |
| JPS5772357A (en) * | 1980-10-24 | 1982-05-06 | Nec Corp | Mounting method of integrated circuit |
| JPS5778158A (en) * | 1980-11-04 | 1982-05-15 | Nippon Telegr & Teleph Corp <Ntt> | Semiconductor integrated circuit device |
| JPS5853838A (ja) * | 1981-09-26 | 1983-03-30 | Mitsubishi Electric Corp | 半導体装置 |
| JPS59163843A (ja) * | 1983-03-09 | 1984-09-14 | Nippon Denso Co Ltd | 半導体装置 |
-
1972
- 1972-03-31 JP JP3248172A patent/JPS5427714B2/ja not_active Expired
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5717178A (en) * | 1980-07-07 | 1982-01-28 | Nec Corp | Field-effect transistor |
| JPS5772357A (en) * | 1980-10-24 | 1982-05-06 | Nec Corp | Mounting method of integrated circuit |
| JPS6143857B2 (US20080094685A1-20080424-C00004.png) * | 1980-10-24 | 1986-09-30 | Nippon Electric Co | |
| JPS5778158A (en) * | 1980-11-04 | 1982-05-15 | Nippon Telegr & Teleph Corp <Ntt> | Semiconductor integrated circuit device |
| JPS5853838A (ja) * | 1981-09-26 | 1983-03-30 | Mitsubishi Electric Corp | 半導体装置 |
| JPS6360533B2 (US20080094685A1-20080424-C00004.png) * | 1981-09-26 | 1988-11-24 | ||
| JPS59163843A (ja) * | 1983-03-09 | 1984-09-14 | Nippon Denso Co Ltd | 半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5427714B2 (US20080094685A1-20080424-C00004.png) | 1979-09-11 |
