JPS473657U - - Google Patents

Info

Publication number
JPS473657U
JPS473657U JP1971005195U JP519571U JPS473657U JP S473657 U JPS473657 U JP S473657U JP 1971005195 U JP1971005195 U JP 1971005195U JP 519571 U JP519571 U JP 519571U JP S473657 U JPS473657 U JP S473657U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1971005195U
Other languages
Japanese (ja)
Other versions
JPS5113009Y2 (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1971005195U priority Critical patent/JPS5113009Y2/ja
Publication of JPS473657U publication Critical patent/JPS473657U/ja
Application granted granted Critical
Publication of JPS5113009Y2 publication Critical patent/JPS5113009Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48455—Details of wedge bonds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48455—Details of wedge bonds
    • H01L2224/48456—Shape

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Thyristors (AREA)
JP1971005195U 1971-02-05 1971-02-05 Expired JPS5113009Y2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1971005195U JPS5113009Y2 (enrdf_load_stackoverflow) 1971-02-05 1971-02-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1971005195U JPS5113009Y2 (enrdf_load_stackoverflow) 1971-02-05 1971-02-05

Publications (2)

Publication Number Publication Date
JPS473657U true JPS473657U (enrdf_load_stackoverflow) 1972-09-06
JPS5113009Y2 JPS5113009Y2 (enrdf_load_stackoverflow) 1976-04-07

Family

ID=27845853

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1971005195U Expired JPS5113009Y2 (enrdf_load_stackoverflow) 1971-02-05 1971-02-05

Country Status (1)

Country Link
JP (1) JPS5113009Y2 (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5795642A (en) * 1981-09-28 1982-06-14 Hitachi Ltd Semiconductor integrated circuit
JPS58167634U (ja) * 1982-05-04 1983-11-08 象印マホービン株式会社 液体容器
JPS6171019A (ja) * 1985-09-09 1986-04-11 東芝熱器具株式会社 電気ポツト

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5795642A (en) * 1981-09-28 1982-06-14 Hitachi Ltd Semiconductor integrated circuit
JPS58167634U (ja) * 1982-05-04 1983-11-08 象印マホービン株式会社 液体容器
JPS6171019A (ja) * 1985-09-09 1986-04-11 東芝熱器具株式会社 電気ポツト

Also Published As

Publication number Publication date
JPS5113009Y2 (enrdf_load_stackoverflow) 1976-04-07

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