JPS4731838U - - Google Patents
Info
- Publication number
- JPS4731838U JPS4731838U JP3119371U JP3119371U JPS4731838U JP S4731838 U JPS4731838 U JP S4731838U JP 3119371 U JP3119371 U JP 3119371U JP 3119371 U JP3119371 U JP 3119371U JP S4731838 U JPS4731838 U JP S4731838U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3119371U JPS4731838U (ja) | 1971-04-20 | 1971-04-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3119371U JPS4731838U (ja) | 1971-04-20 | 1971-04-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4731838U true JPS4731838U (ja) | 1972-12-09 |
Family
ID=27894175
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3119371U Pending JPS4731838U (ja) | 1971-04-20 | 1971-04-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS4731838U (ja) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5626130A (en) * | 1978-10-19 | 1981-03-13 | Nippon Formula Feed Mfg | Feeding of breeded eel |
| US9365934B2 (en) | 2013-04-12 | 2016-06-14 | Mitsubishi Gas Chemical Company, Inc. | Liquid composition used in etching copper- and titanium-containing multilayer film, etching method in which said composition is used, method for manufacturing multilayer-film wiring, and substrate |
-
1971
- 1971-04-20 JP JP3119371U patent/JPS4731838U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5626130A (en) * | 1978-10-19 | 1981-03-13 | Nippon Formula Feed Mfg | Feeding of breeded eel |
| JPS5744289B2 (ja) * | 1978-10-19 | 1982-09-20 | ||
| US9365934B2 (en) | 2013-04-12 | 2016-06-14 | Mitsubishi Gas Chemical Company, Inc. | Liquid composition used in etching copper- and titanium-containing multilayer film, etching method in which said composition is used, method for manufacturing multilayer-film wiring, and substrate |