JPS4724271U - - Google Patents
Info
- Publication number
- JPS4724271U JPS4724271U JP2854171U JP2854171U JPS4724271U JP S4724271 U JPS4724271 U JP S4724271U JP 2854171 U JP2854171 U JP 2854171U JP 2854171 U JP2854171 U JP 2854171U JP S4724271 U JPS4724271 U JP S4724271U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2854171U JPS4724271U (enExample) | 1971-04-14 | 1971-04-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2854171U JPS4724271U (enExample) | 1971-04-14 | 1971-04-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4724271U true JPS4724271U (enExample) | 1972-11-18 |
Family
ID=27889190
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2854171U Pending JPS4724271U (enExample) | 1971-04-14 | 1971-04-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS4724271U (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53119245U (enExample) * | 1977-02-28 | 1978-09-21 | ||
| JPS6076657U (ja) * | 1983-10-28 | 1985-05-29 | 株式会社吉野工業所 | 全方位形注出栓 |
| JPS618552U (ja) * | 1984-06-22 | 1986-01-18 | 株式会社資生堂 | 壜体の蓋栓構造 |
| US11018112B2 (en) | 2014-10-30 | 2021-05-25 | Kabushiki Kaisha Toshiba | Bonding method of semiconductor chip and bonding apparatus of semiconductor chip |
-
1971
- 1971-04-14 JP JP2854171U patent/JPS4724271U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53119245U (enExample) * | 1977-02-28 | 1978-09-21 | ||
| JPS6076657U (ja) * | 1983-10-28 | 1985-05-29 | 株式会社吉野工業所 | 全方位形注出栓 |
| JPS618552U (ja) * | 1984-06-22 | 1986-01-18 | 株式会社資生堂 | 壜体の蓋栓構造 |
| US11018112B2 (en) | 2014-10-30 | 2021-05-25 | Kabushiki Kaisha Toshiba | Bonding method of semiconductor chip and bonding apparatus of semiconductor chip |