JPS4724271U - - Google Patents
Info
- Publication number
- JPS4724271U JPS4724271U JP2854171U JP2854171U JPS4724271U JP S4724271 U JPS4724271 U JP S4724271U JP 2854171 U JP2854171 U JP 2854171U JP 2854171 U JP2854171 U JP 2854171U JP S4724271 U JPS4724271 U JP S4724271U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2854171U JPS4724271U (en) | 1971-04-14 | 1971-04-14 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2854171U JPS4724271U (en) | 1971-04-14 | 1971-04-14 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS4724271U true JPS4724271U (en) | 1972-11-18 |
Family
ID=27889190
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2854171U Pending JPS4724271U (en) | 1971-04-14 | 1971-04-14 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS4724271U (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53119245U (en) * | 1977-02-28 | 1978-09-21 | ||
JPS6076657U (en) * | 1983-10-28 | 1985-05-29 | 株式会社吉野工業所 | Omnidirectional spout tap |
JPS618552U (en) * | 1984-06-22 | 1986-01-18 | 株式会社資生堂 | Bottle lid structure |
US11018112B2 (en) | 2014-10-30 | 2021-05-25 | Kabushiki Kaisha Toshiba | Bonding method of semiconductor chip and bonding apparatus of semiconductor chip |
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1971
- 1971-04-14 JP JP2854171U patent/JPS4724271U/ja active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53119245U (en) * | 1977-02-28 | 1978-09-21 | ||
JPS5711877Y2 (en) * | 1977-02-28 | 1982-03-09 | ||
JPS6076657U (en) * | 1983-10-28 | 1985-05-29 | 株式会社吉野工業所 | Omnidirectional spout tap |
JPS618552U (en) * | 1984-06-22 | 1986-01-18 | 株式会社資生堂 | Bottle lid structure |
US11018112B2 (en) | 2014-10-30 | 2021-05-25 | Kabushiki Kaisha Toshiba | Bonding method of semiconductor chip and bonding apparatus of semiconductor chip |