JPS4720157U - - Google Patents

Info

Publication number
JPS4720157U
JPS4720157U JP807371U JP807371U JPS4720157U JP S4720157 U JPS4720157 U JP S4720157U JP 807371 U JP807371 U JP 807371U JP 807371 U JP807371 U JP 807371U JP S4720157 U JPS4720157 U JP S4720157U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP807371U
Other languages
Japanese (ja)
Other versions
JPS517820Y2 (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1971008073U priority Critical patent/JPS517820Y2/ja
Publication of JPS4720157U publication Critical patent/JPS4720157U/ja
Application granted granted Critical
Publication of JPS517820Y2 publication Critical patent/JPS517820Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)
  • Wire Bonding (AREA)
JP1971008073U 1971-02-15 1971-02-15 Expired JPS517820Y2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1971008073U JPS517820Y2 (enrdf_load_stackoverflow) 1971-02-15 1971-02-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1971008073U JPS517820Y2 (enrdf_load_stackoverflow) 1971-02-15 1971-02-15

Publications (2)

Publication Number Publication Date
JPS4720157U true JPS4720157U (enrdf_load_stackoverflow) 1972-11-07
JPS517820Y2 JPS517820Y2 (enrdf_load_stackoverflow) 1976-03-02

Family

ID=27851085

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1971008073U Expired JPS517820Y2 (enrdf_load_stackoverflow) 1971-02-15 1971-02-15

Country Status (1)

Country Link
JP (1) JPS517820Y2 (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50144297A (enrdf_load_stackoverflow) * 1974-05-11 1975-11-20
JPS6290654U (enrdf_load_stackoverflow) * 1985-11-25 1987-06-10

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS47493U (enrdf_load_stackoverflow) * 1971-01-16 1972-08-02

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS47493U (enrdf_load_stackoverflow) * 1971-01-16 1972-08-02

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50144297A (enrdf_load_stackoverflow) * 1974-05-11 1975-11-20
JPS6290654U (enrdf_load_stackoverflow) * 1985-11-25 1987-06-10

Also Published As

Publication number Publication date
JPS517820Y2 (enrdf_load_stackoverflow) 1976-03-02

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