JPS4710184B1 - - Google Patents
Info
- Publication number
- JPS4710184B1 JPS4710184B1 JP1436368A JP1436368A JPS4710184B1 JP S4710184 B1 JPS4710184 B1 JP S4710184B1 JP 1436368 A JP1436368 A JP 1436368A JP 1436368 A JP1436368 A JP 1436368A JP S4710184 B1 JPS4710184 B1 JP S4710184B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
- H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US624549A US3405323A (en) | 1967-03-20 | 1967-03-20 | Apparatus for cooling electrical components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4710184B1 true JPS4710184B1 (enExample) | 1972-03-27 |
Family
ID=24502414
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1436368A Pending JPS4710184B1 (enExample) | 1967-03-20 | 1968-03-07 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US3405323A (enExample) |
| JP (1) | JPS4710184B1 (enExample) |
| DE (1) | DE1574667A1 (enExample) |
| FR (1) | FR1553394A (enExample) |
| GB (1) | GB1156434A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51111289U (enExample) * | 1975-03-06 | 1976-09-08 |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3524497A (en) * | 1968-04-04 | 1970-08-18 | Ibm | Heat transfer in a liquid cooling system |
| US3794886A (en) * | 1972-06-26 | 1974-02-26 | W Goldman | Fluid cooled semiconductor socket |
| US4396971A (en) * | 1972-07-10 | 1983-08-02 | Amdahl Corporation | LSI Chip package and method |
| JPS5228547B2 (enExample) * | 1972-07-10 | 1977-07-27 | ||
| DE3137034A1 (de) * | 1981-09-17 | 1983-03-24 | Siemens AG, 1000 Berlin und 8000 München | Verfahren und vorrichtung zum waermetausch an festen oberflaechen |
| US4551787A (en) * | 1983-02-07 | 1985-11-05 | Sperry Corporation | Apparatus for use in cooling integrated circuit chips |
| GB2135525B (en) * | 1983-02-22 | 1986-06-18 | Smiths Industries Plc | Heat-dissipating chip carrier substrates |
| GB8304890D0 (en) * | 1983-02-22 | 1983-03-23 | Smiths Industries Plc | Chip-carrier substrates |
| EP0144579B1 (de) * | 1983-11-02 | 1987-10-14 | BBC Brown Boveri AG | Kühlkörper zur Flüssigkeitskühlung von Leistungshalbleiterbauelementen |
| US4603345A (en) * | 1984-03-19 | 1986-07-29 | Trilogy Computer Development Partners, Ltd. | Module construction for semiconductor chip |
| FR2590005B1 (fr) * | 1985-11-08 | 1987-12-11 | Alsthom Cgee | Systeme de composants semi-conducteurs de puissance refroidis par circulation d'un liquide |
| US4942497A (en) * | 1987-07-24 | 1990-07-17 | Nec Corporation | Cooling structure for heat generating electronic components mounted on a substrate |
| US4895005A (en) * | 1988-12-29 | 1990-01-23 | York International Corporation | Motor terminal box mounted solid state starter |
| US5265670A (en) * | 1990-04-27 | 1993-11-30 | International Business Machines Corporation | Convection transfer system |
| JPH07114250B2 (ja) * | 1990-04-27 | 1995-12-06 | インターナショナル・ビジネス・マシーンズ・コーポレイション | 熱伝達システム |
| US5291371A (en) * | 1990-04-27 | 1994-03-01 | International Business Machines Corporation | Thermal joint |
| US5146981A (en) * | 1991-11-14 | 1992-09-15 | Digital Equipment Corporation | Substrate to heatsink interface apparatus and method |
| US5737387A (en) * | 1994-03-11 | 1998-04-07 | Arch Development Corporation | Cooling for a rotating anode X-ray tube |
| GB2354116B (en) * | 1999-09-10 | 2003-12-03 | Llanelli Radiators Ltd | Assembly for electrical/electronic components |
| US6658736B1 (en) * | 2002-08-09 | 2003-12-09 | Unisys Corporation | Method of fabricating a heat exchanger, for regulating the temperature of multiple integrated circuit modules, having a face of a solid malleable metal coated with a release agent |
| JP4465364B2 (ja) * | 2004-02-20 | 2010-05-19 | エレクトロヴァック エージー | プレートスタック、特にはプレートスタックから成る冷却器または冷却器要素の製造方法 |
| DE102010030155A1 (de) * | 2010-06-16 | 2011-12-22 | Behr Gmbh & Co. Kg | Wärmetauscher und Verfahren zum Herstellen eines Wärmetauschers |
| CN102566605A (zh) * | 2012-01-17 | 2012-07-11 | 华为技术有限公司 | 单板冷却装置 |
| EP3086202A1 (en) * | 2015-04-22 | 2016-10-26 | Alcatel Lucent | Thermal interface |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2829271A (en) * | 1953-08-10 | 1958-04-01 | Cormack E Boucher | Heat conductive insulating support |
| US2845516A (en) * | 1955-11-28 | 1958-07-29 | Jones Louis Franklin | Electric cable connector with soldered joints |
| US2937437A (en) * | 1957-01-09 | 1960-05-24 | Gen Dynamics Corp | Method and apparatus for holding a work-piece |
| US2912624A (en) * | 1957-07-29 | 1959-11-10 | Itt | Fluid cooled electronic chassis |
| NL262292A (enExample) * | 1960-04-08 | |||
| NL301549A (enExample) * | 1962-12-17 | |||
| US3275921A (en) * | 1963-04-03 | 1966-09-27 | Westinghouse Electric Corp | Semiconductor rectifier assembly |
-
1967
- 1967-03-20 US US624549A patent/US3405323A/en not_active Expired - Lifetime
-
1968
- 1968-01-30 FR FR1553394D patent/FR1553394A/fr not_active Expired
- 1968-03-07 JP JP1436368A patent/JPS4710184B1/ja active Pending
- 1968-03-15 GB GB02629/68A patent/GB1156434A/en not_active Expired
- 1968-03-19 DE DE19681574667 patent/DE1574667A1/de active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51111289U (enExample) * | 1975-03-06 | 1976-09-08 |
Also Published As
| Publication number | Publication date |
|---|---|
| FR1553394A (enExample) | 1969-01-10 |
| GB1156434A (en) | 1969-06-25 |
| DE1574667A1 (de) | 1971-06-16 |
| US3405323A (en) | 1968-10-08 |