JPS468494B1 - - Google Patents

Info

Publication number
JPS468494B1
JPS468494B1 JP4145968A JP4145968A JPS468494B1 JP S468494 B1 JPS468494 B1 JP S468494B1 JP 4145968 A JP4145968 A JP 4145968A JP 4145968 A JP4145968 A JP 4145968A JP S468494 B1 JPS468494 B1 JP S468494B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4145968A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS468494B1 publication Critical patent/JPS468494B1/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/42Stripping or agents therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293Organic, e.g. plastic
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Weting (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • ing And Chemical Polishing (AREA)
  • Dicing (AREA)
JP4145968A 1967-06-21 1968-06-17 Pending JPS468494B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US647675A US3515607A (en) 1967-06-21 1967-06-21 Method of removing polymerised resist material from a substrate

Publications (1)

Publication Number Publication Date
JPS468494B1 true JPS468494B1 (ja) 1971-03-03

Family

ID=24597859

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4145968A Pending JPS468494B1 (ja) 1967-06-21 1968-06-17

Country Status (7)

Country Link
US (1) US3515607A (ja)
JP (1) JPS468494B1 (ja)
BE (1) BE716678A (ja)
DE (1) DE1765608B1 (ja)
FR (1) FR1570965A (ja)
GB (1) GB1217050A (ja)
NL (1) NL140658B (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19857263A1 (de) * 1998-12-11 2000-03-16 Peter Gammelin Verfahren und Vorrichtung zum Positionieren von Bauelementen auf Trägern
JP2016105442A (ja) * 2014-12-01 2016-06-09 株式会社ディスコ ウエーハの加工方法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3988196A (en) * 1967-10-09 1976-10-26 Western Electric Company, Inc. Apparatus for transferring an oriented array of articles
US3899379A (en) * 1967-10-09 1975-08-12 Western Electric Co Releasable mounting and method of placing an oriented array of devices on the mounting
BE758160A (fr) * 1969-10-31 1971-04-01 Fairchild Camera Instr Co Structure metallique a couches multiples et procede de fabrication d'une telle structure
US3839111A (en) * 1973-08-20 1974-10-01 Rca Corp Method of etching silicon oxide to produce a tapered edge thereon
US4197126A (en) * 1975-06-25 1980-04-08 W. R. Grace & Co. Air etching of polymeric printing plates
JPS63286588A (ja) * 1987-05-19 1988-11-24 Toshiba Corp シャドウマスクの製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US872314A (en) * 1907-08-01 1907-11-26 John M Wilson Process of removing paint and varnish.
GB894255A (en) * 1957-05-02 1962-04-18 Sarkes Tarzian Semiconductor devices and method of manufacturing them
US3240601A (en) * 1962-03-07 1966-03-15 Corning Glass Works Electroconductive coating patterning

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19857263A1 (de) * 1998-12-11 2000-03-16 Peter Gammelin Verfahren und Vorrichtung zum Positionieren von Bauelementen auf Trägern
JP2016105442A (ja) * 2014-12-01 2016-06-09 株式会社ディスコ ウエーハの加工方法

Also Published As

Publication number Publication date
DE1765608B1 (de) 1972-04-27
NL140658B (nl) 1973-12-17
FR1570965A (ja) 1969-06-13
NL6808315A (ja) 1968-12-23
GB1217050A (en) 1970-12-23
BE716678A (ja) 1968-12-02
US3515607A (en) 1970-06-02

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