JPS466577A - - Google Patents
Info
- Publication number
- JPS466577A JPS466577A JP3035971A JP3035971A JPS466577A JP S466577 A JPS466577 A JP S466577A JP 3035971 A JP3035971 A JP 3035971A JP 3035971 A JP3035971 A JP 3035971A JP S466577 A JPS466577 A JP S466577A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
- H10W40/611—Bolts or screws
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
- H10W40/235—Arrangements for cooling characterised by their places of attachment or cooling paths attached to package parts
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US36057A US3641474A (en) | 1970-05-11 | 1970-05-11 | Semiconductor mounting structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS466577A true JPS466577A (https=) | 1971-12-11 |
| JPS4941462B1 JPS4941462B1 (https=) | 1974-11-09 |
Family
ID=21886370
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP46030359A Pending JPS4941462B1 (https=) | 1970-05-11 | 1971-05-07 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US3641474A (https=) |
| JP (1) | JPS4941462B1 (https=) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150105412A1 (en) | 2010-01-06 | 2015-04-16 | Joseph P. Errico | Combination therapy with mdm2 and efgr inhibitors |
| US9073858B2 (en) | 2010-01-06 | 2015-07-07 | Joseph P. Errico | Methods of targeted drug development |
Families Citing this family (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3801874A (en) * | 1972-10-30 | 1974-04-02 | Gen Electric | Isolation mounting for semiconductor device |
| JPS5053624U (https=) * | 1973-09-13 | 1975-05-22 | ||
| DE2626578C2 (de) * | 1976-06-14 | 1984-07-12 | Vdo Adolf Schindling Ag, 6000 Frankfurt | Einrichtung zum lösbaren Verbinden eines elektronischen Bausteins mit einer Leiterplatte |
| US4199654A (en) * | 1977-09-14 | 1980-04-22 | Bunker Ramo Corporation | Semiconductor mounting assembly |
| US4204248A (en) * | 1978-11-20 | 1980-05-20 | General Electric Company | Heat transfer mounting arrangement for a solid state device connected to a circuit board |
| GB2047475B (en) * | 1979-03-31 | 1983-05-25 | Ferranti Ltd | Assembly comprising a releasably clamped module and electrical connector |
| GB2045547B (en) * | 1979-03-31 | 1983-01-26 | Ferranti Ltd | Circuit assemblies |
| GB2045009B (en) * | 1979-03-31 | 1983-02-09 | Ferranti Ltd | Circuit assemblies |
| US4229816A (en) * | 1979-05-29 | 1980-10-21 | Redcom Laboratories, Inc. | Timing signal generation and distribution system for TDM telecommunications systems |
| DE2939503A1 (de) * | 1979-09-28 | 1981-04-09 | Ferranti Ltd | Schaltungsanordnung |
| US4344106A (en) * | 1980-11-26 | 1982-08-10 | Rca Corporation | Transistor heat sink assembly |
| US4495515A (en) * | 1982-07-26 | 1985-01-22 | At&T Bell Laboratories | Electrically isolating two piece mounting washer arrangement |
| US4631819A (en) * | 1985-05-29 | 1986-12-30 | Motorola, Inc. | Low stress, tolerance free method for mounting power devices |
| US4720771A (en) * | 1985-07-05 | 1988-01-19 | Chrysler Motors Corporation | Heat sink assembly for a circuit board mounted integrated circuit |
| US4669028A (en) * | 1986-02-18 | 1987-05-26 | Ncr Corporation | Heat sink for solid state devices connected to a circuit board |
| US4751401A (en) * | 1987-03-23 | 1988-06-14 | Core Industries Inc. | Low voltage switch |
| DE3935272A1 (de) * | 1989-10-24 | 1991-04-25 | Loewe Opta Gmbh | Kuehlblech fuer elektronische bauelemente |
| US5312270A (en) * | 1992-08-25 | 1994-05-17 | The Siemon Company | Wiring block having detachable leg assemblies |
| US5411400A (en) * | 1992-09-28 | 1995-05-02 | Motorola, Inc. | Interconnect system for a semiconductor chip and a substrate |
| DE4237763C2 (de) * | 1992-11-09 | 1996-01-25 | Siemens Ag | Vorrichtung zur isolierten Befestigung von wärmeerzeugenden Halbleiter-Bauteilen |
| DE4416460C2 (de) * | 1994-05-10 | 1996-04-11 | Hella Kg Hueck & Co | Schaltungsanordnung, insbesondere zur Gebläsesteuerung für Kraftfahrzeuge |
| CN1152428C (zh) * | 1995-10-13 | 2004-06-02 | 热合金公司 | 可焊式晶体管夹子和夹子与散热器的组合装置 |
| US5738226A (en) * | 1996-10-31 | 1998-04-14 | Hewlett-Packard Company | Guide piece and method for mounting to a chassis in multiple orientations |
| US6331763B1 (en) * | 1998-04-15 | 2001-12-18 | Tyco Electronics Corporation | Devices and methods for protection of rechargeable elements |
| US6340317B1 (en) | 1998-11-20 | 2002-01-22 | International Connectors & Cable Corporation | Hinged wiring block |
| US6195257B1 (en) * | 1999-02-13 | 2001-02-27 | Lucent Technologies Inc. | Apparatus and method of adapting a rectifier module to enhance cooling |
| TWI244885B (en) * | 2004-12-08 | 2005-12-01 | Delta Electronics Inc | Assembly structure of electronic element and heat sink |
| CN201369475Y (zh) * | 2008-12-05 | 2009-12-23 | 国琏电子（上海）有限公司 | 耐高压连接器 |
| TWI389272B (zh) * | 2009-04-22 | 2013-03-11 | 台達電子工業股份有限公司 | 電子元件之散熱模組及其組裝方法 |
| JP6182474B2 (ja) * | 2014-02-13 | 2017-08-16 | オムロンオートモーティブエレクトロニクス株式会社 | 電子部品の固定構造および固定方法 |
| EP4727278A2 (en) * | 2019-11-18 | 2026-04-15 | Huawei Digital Power Technologies Co., Ltd. | Electronic component with enclosure frame, circuit board with electronic component, and electronic device |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3164750A (en) * | 1965-01-05 | miller | ||
| US2744214A (en) * | 1953-02-20 | 1956-05-01 | Boeing Co | Combined base sockets and terminal boards |
| US2905920A (en) * | 1956-04-11 | 1959-09-22 | Acf Ind Inc | Module assembly |
| US2977512A (en) * | 1958-09-08 | 1961-03-28 | Philco Corp | Modular circuit construction |
| US3522490A (en) * | 1965-06-28 | 1970-08-04 | Texas Instruments Inc | Semiconductor package with heat conducting mounting extending from package on side opposite conductor extensions |
| US3465212A (en) * | 1966-03-10 | 1969-09-02 | Rca Corp | Heat dissipator |
| US3404362A (en) * | 1966-07-29 | 1968-10-01 | Bendix Corp | Selective indexing guide device for electrical connectors of printed circuit cards |
| US3475657A (en) * | 1967-01-03 | 1969-10-28 | Litton Systems Inc | Mounting of electronic components on baseboard or panel |
| FR1521210A (fr) * | 1967-04-28 | 1968-04-12 | Tokyo Shibaura Electric Co | Connecteur électrique |
-
1970
- 1970-05-11 US US36057A patent/US3641474A/en not_active Expired - Lifetime
-
1971
- 1971-05-07 JP JP46030359A patent/JPS4941462B1/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150105412A1 (en) | 2010-01-06 | 2015-04-16 | Joseph P. Errico | Combination therapy with mdm2 and efgr inhibitors |
| US9073858B2 (en) | 2010-01-06 | 2015-07-07 | Joseph P. Errico | Methods of targeted drug development |
| US9273031B2 (en) | 2010-01-06 | 2016-03-01 | Joseph P. Errico | Combination therapy with MDM2 and EFGR inhibitors |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4941462B1 (https=) | 1974-11-09 |
| US3641474A (en) | 1972-02-08 |