JPS466577A - - Google Patents

Info

Publication number
JPS466577A
JPS466577A JP3035971A JP3035971A JPS466577A JP S466577 A JPS466577 A JP S466577A JP 3035971 A JP3035971 A JP 3035971A JP 3035971 A JP3035971 A JP 3035971A JP S466577 A JPS466577 A JP S466577A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3035971A
Other languages
Japanese (ja)
Other versions
JPS4941462B1 (,
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS466577A publication Critical patent/JPS466577A/ja
Publication of JPS4941462B1 publication Critical patent/JPS4941462B1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H10W40/235—Arrangements for cooling characterised by their places of attachment or cooling paths attached to package parts

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP46030359A 1970-05-11 1971-05-07 Pending JPS4941462B1 (,)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US36057A US3641474A (en) 1970-05-11 1970-05-11 Semiconductor mounting structure

Publications (2)

Publication Number Publication Date
JPS466577A true JPS466577A (,) 1971-12-11
JPS4941462B1 JPS4941462B1 (,) 1974-11-09

Family

ID=21886370

Family Applications (1)

Application Number Title Priority Date Filing Date
JP46030359A Pending JPS4941462B1 (,) 1970-05-11 1971-05-07

Country Status (2)

Country Link
US (1) US3641474A (,)
JP (1) JPS4941462B1 (,)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150105412A1 (en) 2010-01-06 2015-04-16 Joseph P. Errico Combination therapy with mdm2 and efgr inhibitors
US9073858B2 (en) 2010-01-06 2015-07-07 Joseph P. Errico Methods of targeted drug development

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3801874A (en) * 1972-10-30 1974-04-02 Gen Electric Isolation mounting for semiconductor device
JPS5053624U (,) * 1973-09-13 1975-05-22
DE2626578C2 (de) * 1976-06-14 1984-07-12 Vdo Adolf Schindling Ag, 6000 Frankfurt Einrichtung zum lösbaren Verbinden eines elektronischen Bausteins mit einer Leiterplatte
US4199654A (en) * 1977-09-14 1980-04-22 Bunker Ramo Corporation Semiconductor mounting assembly
US4204248A (en) * 1978-11-20 1980-05-20 General Electric Company Heat transfer mounting arrangement for a solid state device connected to a circuit board
GB2047475B (en) * 1979-03-31 1983-05-25 Ferranti Ltd Assembly comprising a releasably clamped module and electrical connector
GB2045547B (en) * 1979-03-31 1983-01-26 Ferranti Ltd Circuit assemblies
GB2045009B (en) * 1979-03-31 1983-02-09 Ferranti Ltd Circuit assemblies
US4229816A (en) * 1979-05-29 1980-10-21 Redcom Laboratories, Inc. Timing signal generation and distribution system for TDM telecommunications systems
DE2939503A1 (de) * 1979-09-28 1981-04-09 Ferranti Ltd Schaltungsanordnung
US4344106A (en) * 1980-11-26 1982-08-10 Rca Corporation Transistor heat sink assembly
US4495515A (en) * 1982-07-26 1985-01-22 At&T Bell Laboratories Electrically isolating two piece mounting washer arrangement
US4631819A (en) * 1985-05-29 1986-12-30 Motorola, Inc. Low stress, tolerance free method for mounting power devices
US4720771A (en) * 1985-07-05 1988-01-19 Chrysler Motors Corporation Heat sink assembly for a circuit board mounted integrated circuit
US4669028A (en) * 1986-02-18 1987-05-26 Ncr Corporation Heat sink for solid state devices connected to a circuit board
US4751401A (en) * 1987-03-23 1988-06-14 Core Industries Inc. Low voltage switch
DE3935272A1 (de) * 1989-10-24 1991-04-25 Loewe Opta Gmbh Kuehlblech fuer elektronische bauelemente
US5312270A (en) * 1992-08-25 1994-05-17 The Siemon Company Wiring block having detachable leg assemblies
US5411400A (en) * 1992-09-28 1995-05-02 Motorola, Inc. Interconnect system for a semiconductor chip and a substrate
DE4237763C2 (de) * 1992-11-09 1996-01-25 Siemens Ag Vorrichtung zur isolierten Befestigung von wärmeerzeugenden Halbleiter-Bauteilen
DE4416460C2 (de) * 1994-05-10 1996-04-11 Hella Kg Hueck & Co Schaltungsanordnung, insbesondere zur Gebläsesteuerung für Kraftfahrzeuge
CN1152428C (zh) * 1995-10-13 2004-06-02 热合金公司 可焊式晶体管夹子和夹子与散热器的组合装置
US5738226A (en) * 1996-10-31 1998-04-14 Hewlett-Packard Company Guide piece and method for mounting to a chassis in multiple orientations
US6331763B1 (en) * 1998-04-15 2001-12-18 Tyco Electronics Corporation Devices and methods for protection of rechargeable elements
US6340317B1 (en) 1998-11-20 2002-01-22 International Connectors & Cable Corporation Hinged wiring block
US6195257B1 (en) * 1999-02-13 2001-02-27 Lucent Technologies Inc. Apparatus and method of adapting a rectifier module to enhance cooling
TWI244885B (en) * 2004-12-08 2005-12-01 Delta Electronics Inc Assembly structure of electronic element and heat sink
CN201369475Y (zh) * 2008-12-05 2009-12-23 国琏电子（上海）有限公司 耐高压连接器
TWI389272B (zh) * 2009-04-22 2013-03-11 台達電子工業股份有限公司 電子元件之散熱模組及其組裝方法
JP6182474B2 (ja) * 2014-02-13 2017-08-16 オムロンオートモーティブエレクトロニクス株式会社 電子部品の固定構造および固定方法
EP4727278A2 (en) * 2019-11-18 2026-04-15 Huawei Digital Power Technologies Co., Ltd. Electronic component with enclosure frame, circuit board with electronic component, and electronic device

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3164750A (en) * 1965-01-05 miller
US2744214A (en) * 1953-02-20 1956-05-01 Boeing Co Combined base sockets and terminal boards
US2905920A (en) * 1956-04-11 1959-09-22 Acf Ind Inc Module assembly
US2977512A (en) * 1958-09-08 1961-03-28 Philco Corp Modular circuit construction
US3522490A (en) * 1965-06-28 1970-08-04 Texas Instruments Inc Semiconductor package with heat conducting mounting extending from package on side opposite conductor extensions
US3465212A (en) * 1966-03-10 1969-09-02 Rca Corp Heat dissipator
US3404362A (en) * 1966-07-29 1968-10-01 Bendix Corp Selective indexing guide device for electrical connectors of printed circuit cards
US3475657A (en) * 1967-01-03 1969-10-28 Litton Systems Inc Mounting of electronic components on baseboard or panel
FR1521210A (fr) * 1967-04-28 1968-04-12 Tokyo Shibaura Electric Co Connecteur électrique

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150105412A1 (en) 2010-01-06 2015-04-16 Joseph P. Errico Combination therapy with mdm2 and efgr inhibitors
US9073858B2 (en) 2010-01-06 2015-07-07 Joseph P. Errico Methods of targeted drug development
US9273031B2 (en) 2010-01-06 2016-03-01 Joseph P. Errico Combination therapy with MDM2 and EFGR inhibitors

Also Published As

Publication number Publication date
JPS4941462B1 (,) 1974-11-09
US3641474A (en) 1972-02-08

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