JPS453398Y1 - - Google Patents
Info
- Publication number
- JPS453398Y1 JPS453398Y1 JP1968012302U JP1230268U JPS453398Y1 JP S453398 Y1 JPS453398 Y1 JP S453398Y1 JP 1968012302 U JP1968012302 U JP 1968012302U JP 1230268 U JP1230268 U JP 1230268U JP S453398 Y1 JPS453398 Y1 JP S453398Y1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1968012302U JPS453398Y1 (enExample) | 1968-02-21 | 1968-02-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1968012302U JPS453398Y1 (enExample) | 1968-02-21 | 1968-02-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS453398Y1 true JPS453398Y1 (enExample) | 1970-02-16 |
Family
ID=42832410
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1968012302U Expired JPS453398Y1 (enExample) | 1968-02-21 | 1968-02-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS453398Y1 (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5124861U (enExample) * | 1974-08-12 | 1976-02-24 | ||
| JPS5320765A (en) * | 1976-08-10 | 1978-02-25 | Nippon Telegr & Teleph Corp <Ntt> | Conductor forming method for semiconductor device bonding |
| JPS5349950A (en) * | 1976-10-18 | 1978-05-06 | Matsushita Electronics Corp | Semiconductor device |
-
1968
- 1968-02-21 JP JP1968012302U patent/JPS453398Y1/ja not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5124861U (enExample) * | 1974-08-12 | 1976-02-24 | ||
| JPS5320765A (en) * | 1976-08-10 | 1978-02-25 | Nippon Telegr & Teleph Corp <Ntt> | Conductor forming method for semiconductor device bonding |
| JPS5349950A (en) * | 1976-10-18 | 1978-05-06 | Matsushita Electronics Corp | Semiconductor device |