JPS4530335Y1 - - Google Patents
Info
- Publication number
- JPS4530335Y1 JPS4530335Y1 JP1967034959U JP3495967U JPS4530335Y1 JP S4530335 Y1 JPS4530335 Y1 JP S4530335Y1 JP 1967034959 U JP1967034959 U JP 1967034959U JP 3495967 U JP3495967 U JP 3495967U JP S4530335 Y1 JPS4530335 Y1 JP S4530335Y1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1967034959U JPS4530335Y1 (enExample) | 1967-04-27 | 1967-04-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1967034959U JPS4530335Y1 (enExample) | 1967-04-27 | 1967-04-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4530335Y1 true JPS4530335Y1 (enExample) | 1970-11-20 |
Family
ID=42858494
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1967034959U Expired JPS4530335Y1 (enExample) | 1967-04-27 | 1967-04-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS4530335Y1 (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS521066U (enExample) * | 1975-06-23 | 1977-01-06 | ||
| US7074797B2 (en) | 1996-02-07 | 2006-07-11 | Neurocrine Biosciences, Inc. | Pyrazolopyrimidines as CRF receptor antagonists |
-
1967
- 1967-04-27 JP JP1967034959U patent/JPS4530335Y1/ja not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS521066U (enExample) * | 1975-06-23 | 1977-01-06 | ||
| US7074797B2 (en) | 1996-02-07 | 2006-07-11 | Neurocrine Biosciences, Inc. | Pyrazolopyrimidines as CRF receptor antagonists |