JPS4528098Y1 - - Google Patents
Info
- Publication number
- JPS4528098Y1 JPS4528098Y1 JP1967072341U JP7234167U JPS4528098Y1 JP S4528098 Y1 JPS4528098 Y1 JP S4528098Y1 JP 1967072341 U JP1967072341 U JP 1967072341U JP 7234167 U JP7234167 U JP 7234167U JP S4528098 Y1 JPS4528098 Y1 JP S4528098Y1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1967072341U JPS4528098Y1 (en, 2012) | 1967-08-22 | 1967-08-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1967072341U JPS4528098Y1 (en, 2012) | 1967-08-22 | 1967-08-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4528098Y1 true JPS4528098Y1 (en, 2012) | 1970-10-29 |
Family
ID=42856309
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1967072341U Expired JPS4528098Y1 (en, 2012) | 1967-08-22 | 1967-08-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS4528098Y1 (en, 2012) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4857652U (en, 2012) * | 1971-11-02 | 1973-07-23 | ||
| JPS4964863A (en, 2012) * | 1972-10-23 | 1974-06-24 | ||
| JPS5010564A (en, 2012) * | 1973-05-25 | 1975-02-03 |
-
1967
- 1967-08-22 JP JP1967072341U patent/JPS4528098Y1/ja not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4857652U (en, 2012) * | 1971-11-02 | 1973-07-23 | ||
| JPS4964863A (en, 2012) * | 1972-10-23 | 1974-06-24 | ||
| JPS5010564A (en, 2012) * | 1973-05-25 | 1975-02-03 |