JPS447544Y1 - - Google Patents
Info
- Publication number
- JPS447544Y1 JPS447544Y1 JP3728966U JP3728966U JPS447544Y1 JP S447544 Y1 JPS447544 Y1 JP S447544Y1 JP 3728966 U JP3728966 U JP 3728966U JP 3728966 U JP3728966 U JP 3728966U JP S447544 Y1 JPS447544 Y1 JP S447544Y1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3728966U JPS447544Y1 (en) | 1966-04-23 | 1966-04-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3728966U JPS447544Y1 (en) | 1966-04-23 | 1966-04-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS447544Y1 true JPS447544Y1 (en) | 1969-03-22 |
Family
ID=31772220
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3728966U Expired JPS447544Y1 (en) | 1966-04-23 | 1966-04-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS447544Y1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016071982A1 (en) * | 2014-11-06 | 2016-05-12 | 三菱電機株式会社 | Semiconductor module and conductive member for semiconductor module |
-
1966
- 1966-04-23 JP JP3728966U patent/JPS447544Y1/ja not_active Expired
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016071982A1 (en) * | 2014-11-06 | 2016-05-12 | 三菱電機株式会社 | Semiconductor module and conductive member for semiconductor module |
| JPWO2016071982A1 (en) * | 2014-11-06 | 2017-04-27 | 三菱電機株式会社 | Semiconductor module and conductive member for semiconductor module |
| CN107078126A (en) * | 2014-11-06 | 2017-08-18 | 三菱电机株式会社 | The conductive member of semiconductor module and semiconductor module |
| US10475667B2 (en) | 2014-11-06 | 2019-11-12 | Mitsubishi Electric Corporation | Semiconductor module and conductive member for semiconductor module including cut in bent portion |