JPS4318829Y1 - - Google Patents
Info
- Publication number
- JPS4318829Y1 JPS4318829Y1 JP1965053375U JP5337565U JPS4318829Y1 JP S4318829 Y1 JPS4318829 Y1 JP S4318829Y1 JP 1965053375 U JP1965053375 U JP 1965053375U JP 5337565 U JP5337565 U JP 5337565U JP S4318829 Y1 JPS4318829 Y1 JP S4318829Y1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1965053375U JPS4318829Y1 (enrdf_load_stackoverflow) | 1965-06-29 | 1965-06-29 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1965053375U JPS4318829Y1 (enrdf_load_stackoverflow) | 1965-06-29 | 1965-06-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS4318829Y1 true JPS4318829Y1 (enrdf_load_stackoverflow) | 1968-08-05 |
Family
ID=31787447
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1965053375U Expired JPS4318829Y1 (enrdf_load_stackoverflow) | 1965-06-29 | 1965-06-29 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS4318829Y1 (enrdf_load_stackoverflow) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3962406A (en) * | 1967-11-25 | 1976-06-08 | U.S. Philips Corporation | Method of manufacturing silicon carbide crystals |
JPS5326862U (enrdf_load_stackoverflow) * | 1976-08-13 | 1978-03-07 | ||
JPS5437681A (en) * | 1977-08-31 | 1979-03-20 | Hitachi Ltd | Flat type semiconductor device |
-
1965
- 1965-06-29 JP JP1965053375U patent/JPS4318829Y1/ja not_active Expired
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3962406A (en) * | 1967-11-25 | 1976-06-08 | U.S. Philips Corporation | Method of manufacturing silicon carbide crystals |
JPS5326862U (enrdf_load_stackoverflow) * | 1976-08-13 | 1978-03-07 | ||
JPS5437681A (en) * | 1977-08-31 | 1979-03-20 | Hitachi Ltd | Flat type semiconductor device |