JPS4318829Y1 - - Google Patents

Info

Publication number
JPS4318829Y1
JPS4318829Y1 JP1965053375U JP5337565U JPS4318829Y1 JP S4318829 Y1 JPS4318829 Y1 JP S4318829Y1 JP 1965053375 U JP1965053375 U JP 1965053375U JP 5337565 U JP5337565 U JP 5337565U JP S4318829 Y1 JPS4318829 Y1 JP S4318829Y1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1965053375U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1965053375U priority Critical patent/JPS4318829Y1/ja
Publication of JPS4318829Y1 publication Critical patent/JPS4318829Y1/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/33Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors

Landscapes

  • Die Bonding (AREA)
JP1965053375U 1965-06-29 1965-06-29 Expired JPS4318829Y1 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1965053375U JPS4318829Y1 (enrdf_load_stackoverflow) 1965-06-29 1965-06-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1965053375U JPS4318829Y1 (enrdf_load_stackoverflow) 1965-06-29 1965-06-29

Publications (1)

Publication Number Publication Date
JPS4318829Y1 true JPS4318829Y1 (enrdf_load_stackoverflow) 1968-08-05

Family

ID=31787447

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1965053375U Expired JPS4318829Y1 (enrdf_load_stackoverflow) 1965-06-29 1965-06-29

Country Status (1)

Country Link
JP (1) JPS4318829Y1 (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3962406A (en) * 1967-11-25 1976-06-08 U.S. Philips Corporation Method of manufacturing silicon carbide crystals
JPS5326862U (enrdf_load_stackoverflow) * 1976-08-13 1978-03-07
JPS5437681A (en) * 1977-08-31 1979-03-20 Hitachi Ltd Flat type semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3962406A (en) * 1967-11-25 1976-06-08 U.S. Philips Corporation Method of manufacturing silicon carbide crystals
JPS5326862U (enrdf_load_stackoverflow) * 1976-08-13 1978-03-07
JPS5437681A (en) * 1977-08-31 1979-03-20 Hitachi Ltd Flat type semiconductor device

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